70-1607-0504

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Kester Solder

SOLDERPASTE NO CLEAN 63/37 100GM

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Active

Kester Solder

SOLDERPASTE NO CLEAN 63/37 100GM

Technical Specifications

Parameters and characteristics for this part

Specification	70-1607-0504

Flux Type	No-Clean
Form	35 g
Form	1.23 oz
Form	10 cc
Form	Syringe
Melting Point [custom]	361 °F
Melting Point [custom]	183 °C
Mesh Type	3
Process	Leaded
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Storage/Refrigeration Temperature [Max]	50 °F
Storage/Refrigeration Temperature [Max]	10 °C
Storage/Refrigeration Temperature [Min]	0 °C
Storage/Refrigeration Temperature [Min]	0 °C
Type	Solder Paste
Weight	99.79 g
Weight	0.22 lb

Part	Shipping Info	Type	Shelf Life Start	Shelf Life	Form	Form	Form	Form	Mesh Type	Process	Weight	Weight	Melting Point [custom]	Melting Point [custom]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Flux Type
Kester Solder 70-1607-0520	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	Solder Paste	Date of Manufacture	6 Months	35 g	1.23 oz	10 cc	Syringe	3	Leaded	34.93 g	0.077 lb	361 °F	183 °C	0 °C	50 °F	10 °C	0 °C	No-Clean
Kester Solder 70-1607-0504	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	Solder Paste	Date of Manufacture	6 Months	35 g	1.23 oz	10 cc	Syringe	3	Leaded	99.79 g	0.22 lb	361 °F	183 °C	0 °C	50 °F	10 °C	0 °C	No-Clean

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Dispenser	50	$ 68.66