216-7224-55-1902
ActiveIC & COMPONENT SOCKET, 16 CONTACTS, SOIC SOCKET, 2.54 MM, 216-7224 SERIES, 7.62 MM
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216-7224-55-1902
ActiveIC & COMPONENT SOCKET, 16 CONTACTS, SOIC SOCKET, 2.54 MM, 216-7224 SERIES, 7.62 MM
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Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 216-7224-55-1902 | 216 Series |
|---|---|---|
| Contact Finish - Mating | Gold | Gold |
| Contact Finish - Post | Gold | Gold |
| Contact Finish Thickness - Mating | - | 30 Áin |
| Contact Finish Thickness - Mating | - | 0.76 Ám |
| Contact Finish Thickness - Post | 30 µin | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm | 0.76 µm |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper |
| Contact Material - Post | Beryllium Copper | Beryllium Copper |
| Current Rating (Amps) | 1 A | 1 A |
| Features | Closed Frame | Closed Frame |
| Housing Material | Polyethersulfone (PES), Glass Filled | Polyethersulfone (PES), Glass Filled, Polysulfone (PSU), Glass Filled |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 |
| Mounting Type | Through Hole | Through Hole, Connector |
| Number of Positions or Pins (Grid) | 16 | 16 |
| Operating Temperature [Max] | 150 °C | 125 - 150 °C |
| Operating Temperature [Min] | -55 °C | -55 °C |
| Pitch - Mating | - | 0.1 in |
| Pitch - Mating | - | 2.54 mm |
| Pitch - Post | - | 2.54 mm |
| Pitch - Post | - | 0.1 in |
| Termination | Solder | Solder, Press-Fit |
| Termination Post Length | 3.56 mm | 2.78 - 3.56 mm |
| Termination Post Length | 0.14 in | 0.11 - 0.14 in |
| Type | SOIC | SOIC, DIP, ZIF (ZIP) |
| Type | - | 7.62 mm |
| Type | - | 0.3 in |
216 Series
IC & COMPONENT SOCKET, 16 CONTACTS, SOIC SOCKET, 2.54 MM, 216-7224 SERIES, 7.62 MM
| Part | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Mating | Current Rating (Amps) | Termination | Material Flammability Rating | Mounting Type | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Contact Finish - Mating | Number of Positions or Pins (Grid) | Contact Material - Post | Termination Post Length | Termination Post Length | Type | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Polyethersulfone (PES), Glass Filled | -55 °C | 150 °C | Beryllium Copper | 1 A | Solder | UL94 V-0 | Through Hole | Closed Frame | 30 µin | 0.76 µm | Gold | Gold | 16 | Beryllium Copper | 3.56 mm | 0.14 in | SOIC | |||||||||
Polysulfone (PSU), Glass Filled | -55 °C | 125 °C | Beryllium Copper | 1 A | Press-Fit | UL94 V-0 | Connector | Closed Frame | 30 µin | 0.76 µm | Gold | Gold | 16 | Beryllium Copper | 2.78 mm | 0.11 in | DIP, ZIF (ZIP) | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | 7.62 mm | 0.3 in | |
Polyethersulfone (PES), Glass Filled | -55 °C | 150 °C | Beryllium Copper | 1 A | Solder | UL94 V-0 | Through Hole | Closed Frame | 30 µin | 0.76 µm | Gold | Gold | 16 | Beryllium Copper | 3.56 mm | 0.14 in | SOIC |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 50.61 | |
| 10 | $ 39.19 | |||
| 25 | $ 35.57 | |||
| 50 | $ 33.13 | |||
| 100 | $ 30.91 | |||
| 250 | $ 28.31 | |||
Description
General part information
216 Series
The 216-7224-55-1902 is a 16-lead test and burn-in SOIC Socket made of glass-filled polyethersulfone. The socket lid is actuated from top or front and is compatible with automated load/unload equipment. The compact envelope and side to side stack-ability maximize board density.
Documents
Technical documentation and resources