IC & COMPONENT SOCKET, 16 CONTACTS, SOIC SOCKET, 2.54 MM, 216-7224 SERIES, 7.62 MM
| Part | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Mating | Current Rating (Amps) | Termination | Material Flammability Rating | Mounting Type | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Contact Finish - Mating | Number of Positions or Pins (Grid) | Contact Material - Post | Termination Post Length | Termination Post Length | Type | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Polyethersulfone (PES), Glass Filled | -55 °C | 150 °C | Beryllium Copper | 1 A | Solder | UL94 V-0 | Through Hole | Closed Frame | 30 µin | 0.76 µm | Gold | Gold | 16 | Beryllium Copper | 3.56 mm | 0.14 in | SOIC | |||||||||
Polysulfone (PSU), Glass Filled | -55 °C | 125 °C | Beryllium Copper | 1 A | Press-Fit | UL94 V-0 | Connector | Closed Frame | 30 µin | 0.76 µm | Gold | Gold | 16 | Beryllium Copper | 2.78 mm | 0.11 in | DIP, ZIF (ZIP) | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | 7.62 mm | 0.3 in | |
Polyethersulfone (PES), Glass Filled | -55 °C | 150 °C | Beryllium Copper | 1 A | Solder | UL94 V-0 | Through Hole | Closed Frame | 30 µin | 0.76 µm | Gold | Gold | 16 | Beryllium Copper | 3.56 mm | 0.14 in | SOIC |