DTD513ZETL
ActiveRohm Semiconductor
NPN, SOT-416, R1≠R2 LEAK ABSORPTION TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)
DTD513ZETL
ActiveRohm Semiconductor
NPN, SOT-416, R1≠R2 LEAK ABSORPTION TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)
Description
General part information
DTD513 Series
These are the standard products of "digital transistors" which ROHM invented and marketed first in the world.
Technical Specifications
Parameters and characteristics for this part
| Specification | DTD513ZETL |
|---|---|
| Current - Collector (Ic) (Max) | 500 mA |
| Current - Collector Cutoff (Max) | 500 nA |
| DC Current Gain (hFE) (Min) | 140 |
| Frequency - Transition | 260 MHz |
| Mounting Type | Surface Mount |
| Package / Case | SOT-416, SC-75 |
| Package Name | EMT3 |
| Power - Max | 150 mW |
| Resistor - Base (R1) Resistance | 1 kOhm |
| Resistor - Emitter Base (R2) | 10 kOhms |
| Transistor Type | Pre-Biased, NPN |
| Vce Saturation (Max) | 300 mV |
| Voltage - Collector Emitter Breakdown (Max) | 12 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
About Export Regulations
About Flammability of Materials
PCB Layout Thermal Design Guide
Method for Monitoring Switching Waveform
Reliability Test Result
Types and Features of Transistors
Impedance Characteristics of Bypass Capacitor
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Temperature derating method for Safe Operating Area (SOA)
Inner Structure
What is a Thermal Model? (Transistor)
Notes for Temperature Measurement Using Thermocouples
Two-Resistor Model for Thermal Simulation
How to Create Symbols for PSpice Models
What Is Thermal Design
Measurement Method and Usage of Thermal Resistance RthJC
ESD Data
Precautions When Measuring the Rear of the Package with a Thermocouple
How to Use LTspice® Models: Tips for Improving Convergence
Certificate of not containing SVHC under REACH Regulation
Importance of Probe Calibration When Measuring Power: Deskew
Anti-Whisker formation - Transistors
Moisture Sensitivity Level - Transistors
List of Transistor Package Thermal Resistance
Package Dimensions
Condition of Soldering / Land Pattern Reference
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Compliance of the RoHS directive
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Notes for Calculating Power Consumption:Static Operation
Calculation of Power Dissipation in Switching Circuit
Explanation for Marking
Taping Information
Part Explanation
How to Use LTspice® Models
Basics of Thermal Resistance and Heat Dissipation
DTA114EEFRA
