
IQDH29NE2LM5CGATMA1
Active25 V MOSFET PQFN 5X6MM2 SOURCE DOWN PACKAGE WITH INDUSTRY-LEADING RDS(ON).
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IQDH29NE2LM5CGATMA1
Active25 V MOSFET PQFN 5X6MM2 SOURCE DOWN PACKAGE WITH INDUSTRY-LEADING RDS(ON).
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Technical Specifications
Parameters and characteristics for this part
| Specification | IQDH29NE2LM5CGATMA1 |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 75 A, 789 A |
| Drain to Source Voltage (Vdss) | 25 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V, 4.5 V |
| FET Type | N-Channel |
| Input Capacitance (Ciss) (Max) @ Vds [Max] | 17000 pF |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | 9-PowerTDFN |
| Power Dissipation (Max) | 2.5 W |
| Power Dissipation (Max) | 278 W |
| Rds On (Max) @ Id, Vgs | 0.29 mOhm |
| Supplier Device Package | PG-TTFN-9-U02 |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 16 V |
| Vgs(th) (Max) @ Id | 2 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 3.50 | |
| 10 | $ 3.15 | |||
| 25 | $ 2.97 | |||
| 100 | $ 2.58 | |||
| 250 | $ 2.45 | |||
| 500 | $ 2.19 | |||
| 1000 | $ 1.85 | |||
| 2500 | $ 1.76 | |||
| Digi-Reel® | 1 | $ 3.50 | ||
| 10 | $ 3.15 | |||
| 25 | $ 2.97 | |||
| 100 | $ 2.58 | |||
| 250 | $ 2.45 | |||
| 500 | $ 2.19 | |||
| 1000 | $ 1.85 | |||
| 2500 | $ 1.76 | |||
| Tape & Reel (TR) | 5000 | $ 1.69 | ||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 3.17 | |
| 10 | $ 2.37 | |||
| 25 | $ 2.17 | |||
| 50 | $ 2.07 | |||
| 100 | $ 1.96 | |||
| 250 | $ 1.85 | |||
| 500 | $ 1.79 | |||
| 1000 | $ 1.74 | |||
Description
General part information
IQDH29 Series
The power MOSFET IQDH29NE2LM5CG 25 V comes in a PQFN 5x6 mm2Source-Downpackage. The part offers the industry’s lowest RDS(on)of 0.29 mΩ combined with outstanding thermal performance for easy power loss management. This enables higher system efficiency and power density for a large variety of end applications likeSMPS,telecompower, and intermediate bus conversion in high-performance computing, like hyper-scale data centers and AI-server farms.
Documents
Technical documentation and resources