
BR24G512FVT-5AE2
ActiveRohm Semiconductor
512K BIT, I²C BUS, HIGH SPEED WRITE CYCLE, HIGH ENDURANCE, LOW CURRENT CONSUMPTION SERIAL EEPROM

BR24G512FVT-5AE2
ActiveRohm Semiconductor
512K BIT, I²C BUS, HIGH SPEED WRITE CYCLE, HIGH ENDURANCE, LOW CURRENT CONSUMPTION SERIAL EEPROM
Description
General part information
BR24G512 Series
BR24G512xxx-5A Series is a 512 Kbit serial EEPROM of I²C BUS Interface.
Technical Specifications
Parameters and characteristics for this part
| Specification | BR24G512FVT-5AE2 |
|---|---|
| Clock Frequency | 1 MHz |
| Memory Depth | 64 K |
| Memory Format | EEPROM |
| Memory Interface (Type) | I2C |
| Memory Size | 64 kB |
| Memory Type | Non-Volatile |
| Memory Width | 8 bit |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -40 °C |
| Package Length | 0.173 in |
| Package Name | 8-TSSOP-B, 8-TSSOP |
| Package Width | 4.4 mm |
| Technology | EEPROM |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 1.6 V |
| Write Cycle Time - Page | 3.5 ms |
| Write Cycle Time - Word | 3.5 ms |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Technical Data Sheet EN
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Solder Joint Rate and Thermal Resistance of Exposed Pad
Five Steps for Successful Thermal Design of IC
Thermal Resistance
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Basics of Thermal Resistance and Heat Dissipation
Factory Information
Address and Page Configuration of I<sup>2</sup>C BUS EEPROM
Impedance Characteristics of Bypass Capacitor
What Is Thermal Design
Design Guide and Example of Stencil for Exposed Pad
TSSOP-B8 Package Information
Method for Calculating Junction Temperature from Transient Thermal Resistance Data