RBQ30TB45BNZC9
ActiveRohm Semiconductor
LOW IR, 45V, 30A, ITO-220AC, SCHOTTKY BARRIER DIODE
RBQ30TB45BNZC9
ActiveRohm Semiconductor
LOW IR, 45V, 30A, ITO-220AC, SCHOTTKY BARRIER DIODE
Description
General part information
RBQ30 Series
ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.
Technical Specifications
Parameters and characteristics for this part
| Specification | RBQ30TB45BNZC9 |
|---|---|
| Current - Average Rectified (Io) | 30 A |
| Current - Reverse Leakage | 350 µA |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-2 Full Pack |
| Package Name | TO-220FN-2 |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 45 V |
| Voltage - Forward (Vf) (Max) | 590 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Part Explanation
Reliability Test Result
List of Diode Package Thermal Resistance
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Notes for Temperature Measurement Using Thermocouples
Moisture Sensitivity Level - Diodes
Power Loss and Thermal Design of Diodes
Condition of Soldering / Land Pattern Reference
Impedance Characteristics of Bypass Capacitor
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
What is a Thermal Model? (Diode)
About Flammability of Materials
ESD Data
Certificate of not containing SVHC under REACH Regulation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
PCB Layout Thermal Design Guide
Measurement Method and Usage of Thermal Resistance RthJC
About Export Regulations
Absolute Maximum Rating and Electrical Characteristics of Diodes
How to Use LTspice® Models: Tips for Improving Convergence
Notes for Calculating Power Consumption:Static Operation
Anti-Whisker formation - Diodes
Precautions When Measuring the Rear of the Package with a Thermocouple
Judgment Criteria of Thermal Evaluation
Inner Structure
Diode Types and Applications
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Explanation for Marking
Package Dimensions
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Importance of Probe Calibration When Measuring Power: Deskew
Diode Selection Method for Asynchronous Converter
How to Use LTspice® Models
Method for Monitoring Switching Waveform
Basics of Thermal Resistance and Heat Dissipation
How to Select Reverse Current Protection Diodes for LDO Regulators
Taping Information
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Compliance of the RoHS directive
RBQ30TB45BNZ Data Sheet
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Two-Resistor Model for Thermal Simulation
How to Create Symbols for PSpice Models
How to Select Rectifier Diodes
What Is Thermal Design
