2SCR567F3TR
ActiveRohm Semiconductor
SMALL AND EXCELLENT THERMAL CONDUCTIVITY, NPN 2.5A 120V MIDDLE POWER TRANSISTOR
2SCR567F3TR
ActiveRohm Semiconductor
SMALL AND EXCELLENT THERMAL CONDUCTIVITY, NPN 2.5A 120V MIDDLE POWER TRANSISTOR
Description
General part information
2SCR567F3 Series
2SCR567F3 is a middle power transistor with Low VCE(sat), suitable for low frequency amplifier. HUML2020L3 (DFN2020-3S) is a small leadless surface mount package with excellent thermal and electrical conductivity.
Technical Specifications
Parameters and characteristics for this part
| Specification | 2SCR567F3TR |
|---|---|
| Current - Collector (Ic) (Max) | 2.5 A |
| Current - Collector Cutoff (Max) | 1 µA |
| DC Current Gain (hFE) (Min) | 120 |
| Frequency - Transition | 220 MHz |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | 3-UDFN Exposed Pad |
| Package Name | HUML2020L3 |
| Power - Max | 1 VA |
| Transistor Type | NPN |
| Vce Saturation (Max) | 200 mV |
| Voltage - Collector Emitter Breakdown (Max) | 120 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
PCB Layout Thermal Design Guide
Calculation of Power Dissipation in Switching Circuit
How to Create Symbols for PSpice Models
Method for Monitoring Switching Waveform
Moisture Sensitivity Level - Transistors
What is a Thermal Model? (Transistor)
List of Transistor Package Thermal Resistance
2SCR567F3 Thermal Resistance
Notes for Calculating Power Consumption:Static Operation
2SCR567F3 ESD Data
Condition of Soldering / Land Pattern Reference
Certificate of not containing SVHC under REACH Regulation
Explanation for Marking
Precautions When Measuring the Rear of the Package with a Thermocouple
About Export Regulations
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Importance of Probe Calibration When Measuring Power: Deskew
Package Dimensions
Notes for Temperature Measurement Using Thermocouples
How to Use LTspice® Models
What Is Thermal Design
Basics of Thermal Resistance and Heat Dissipation
Reliability Test Result
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
About Flammability of Materials
Impedance Characteristics of Bypass Capacitor
Inner Structure
Types and Features of Transistors
Anti-Whisker formation - Transistors
Compliance of the RoHS directive
How to Use LTspice® Models: Tips for Improving Convergence
Part Explanation
Two-Resistor Model for Thermal Simulation
Measurement Method and Usage of Thermal Resistance RthJC
Temperature derating method for Safe Operating Area (SOA)