HIC-764-SST

Obsolete

Samtec Inc.

CONN IC DIP SOCKET 64POS GOLD

Search across all available documentation for this part.

Obsolete

Samtec Inc.

CONN IC DIP SOCKET 64POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	HIC-764-SST

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Features	Open Frame
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	64
Pitch - Mating	0.07 in
Pitch - Mating	1.78 mm
Pitch - Post	0.07 in
Pitch - Post	1.78 mm
Termination	Solder
Termination Post Length	0.118 in
Termination Post Length	3 mm
Type	DIP
Type	0.75 in
Type	19.05 mm

Part	Material Flammability Rating	Number of Positions or Pins (Grid)	Contact Material - Mating	Features	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Contact Finish - Post	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Pitch - Post	Pitch - Post	Contact Finish - Mating
Samtec Inc. HIC-764-SST	UL94 V-0	64	Beryllium Copper	Open Frame	Brass	0.07 in	1.78 mm	DIP	0.75 in	19.05 mm	10 çin	0.25 çm	Through Hole	Gold	0.118 in	3 mm	200 µin	5.08 µm	Solder	0.07 in	1.78 mm	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

64 (2 x 32) Pos DIP, 0.75" (19.05mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources