TPSM53604RDAR
Active36-V, 4-A STEP-DOWN POWER MODULE IN SMALL 5.5 X 5 X 4-MM ENHANCED HOTROD™ QFN WITH SIMPLE FOOTPRINT 15-B3QFN -40 TO 125
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TPSM53604RDAR
Active36-V, 4-A STEP-DOWN POWER MODULE IN SMALL 5.5 X 5 X 4-MM ENHANCED HOTROD™ QFN WITH SIMPLE FOOTPRINT 15-B3QFN -40 TO 125
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Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | TPSM53604RDAR | TPSM53604 Series |
|---|---|---|
| Applications | ITE (Commercial) | ITE (Commercial) |
| Board Type | - | Fully Populated |
| Control Features | Enable, Active High | Enable, Active High |
| Current - Output | - | 4 A |
| Current - Output (Max) [Max] | 4 A | 4 A |
| Efficiency | 95 % | 95 % |
| Features | Adjustable Output | Adjustable Output |
| Main Purpose | - | DC/DC, Step Down |
| Mounting Type | Surface Mount | Surface Mount |
| Number of Outputs | 1 | 1 |
| Operating Temperature [Max] | 105 ░C | 105 ░C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Outputs and Type | - | Non-Isolated |
| Outputs and Type | - | 1 |
| Package / Case | 15-PowerBQFN Module | 15-PowerBQFN Module |
| Size / Dimension [x] | 0.22 in | 0.22 in |
| Size / Dimension [x] | 5.5 mm | 5.5 mm |
| Size / Dimension [y] | 5 mm | 5 mm |
| Size / Dimension [y] | 0.2 in | 0.2 in |
| Size / Dimension [z] | 0.16 " | 0.16 " |
| Size / Dimension [z] | 4.1 mm | 4.1 mm |
| Supplied Contents | - | Board(s) |
| Supplier Device Package | 15-B3QFN (5x5.5) | 15-B3QFN (5x5.5) |
| Type | Non-Isolated PoL Module | Non-Isolated PoL Module |
| Utilized IC / Part | - | TPSM53604 |
| Voltage - Input | - | 36 V |
| Voltage - Input | - | 3.8 V |
| Voltage - Input (Max) [Max] | 36 V | 36 V |
| Voltage - Input (Min) [Min] | 3.8 V | 3.8 V |
| Voltage - Output | - | 5V, 1.2V, 2.5V, 1.8V, 3.3V |
| Voltage - Output 1 [Max] | 7 V | 7 V |
| Voltage - Output 1 [Min] | 1 V | 1 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
TPSM53604 Series
EVAL BOARD FOR TPSM53604
| Part | Supplied Contents | Current - Output | Board Type | Voltage - Output | Main Purpose | Voltage - Input [Max] | Voltage - Input [Min] | Utilized IC / Part | Outputs and Type | Outputs and Type | Voltage - Input (Min) [Min] | Type | Operating Temperature [Min] | Operating Temperature [Max] | Number of Outputs | Efficiency | Voltage - Output 1 [Min] | Voltage - Output 1 [Max] | Control Features | Supplier Device Package | Voltage - Input (Max) [Max] | Applications | Features | Package / Case | Current - Output (Max) [Max] | Size / Dimension [x] | Size / Dimension [z] | Size / Dimension [z] | Size / Dimension [y] | Size / Dimension [y] | Size / Dimension [x] | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Board(s) | 4 A | Fully Populated | 1.2V, 1.8V, 2.5V, 3.3V, 5V | DC/DC, Step Down | 36 V | 3.8 V | TPSM53604 | Non-Isolated | 1 | |||||||||||||||||||||||
Texas Instruments TPSM53604RDARThe TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.
The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications. | 3.8 V | Non-Isolated PoL Module | -40 °C | 105 ░C | 1 | 95 % | 1 V | 7 V | Active High, Enable | 15-B3QFN (5x5.5) | 36 V | ITE (Commercial) | Adjustable Output | 15-PowerBQFN Module | 4 A | 0.22 in | 0.16 " | 4.1 mm | 5 mm | 0.2 in | 5.5 mm | Surface Mount |
Description
General part information
TPSM53604 Series
The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.
The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
Documents
Technical documentation and resources