RGS50TSX2HRC11
ActiveRohm Semiconductor
IGBTS 1200V 25A FIELD STOP TRENCH IGBT. RGS50TSX2HR IS A HIGHLY RELIABLE IGBT FOR AUTOMOTIVE INVERTER, HEATER.
RGS50TSX2HRC11
ActiveRohm Semiconductor
IGBTS 1200V 25A FIELD STOP TRENCH IGBT. RGS50TSX2HR IS A HIGHLY RELIABLE IGBT FOR AUTOMOTIVE INVERTER, HEATER.
Description
General part information
RGS50 Series
RGS50TSX2HR is a highly reliable IGBT for automotive inverter, heater.
Technical Specifications
Parameters and characteristics for this part
| Specification | RGS50TSX2HRC11 |
|---|---|
| Current - Collector (Ic) (Max) | 50 A |
| Current - Collector Pulsed (Icm) | 75 A |
| Gate Charge | 67 nC |
| IGBT Type | Trench Field Stop |
| Input Type | Standard |
| Mounting Type | Through Hole |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | TO-247-3 |
| Package Name | TO-247N |
| Power - Max | 395 W |
| Switching Energy (Off) | 1.65 mJ |
| Switching Energy (On) | 1.4 mJ |
| Td (off) @ 25°C | 140 ns |
| Td (on) @ 25°C | 37 ns |
| Test Condition Current | 25 A |
| Test Condition Resistance | 10 Ohm |
| Test Condition Voltage | 600 V |
| Test Condition Voltage (Secondary) | 15 V |
| Vce(on) (Max) | 2.1 V |
| Voltage - Collector Emitter Breakdown (Max) | 1200 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
How to Create Symbols for PSpice Models
Two-Resistor Model for Thermal Simulation
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Precautions for Thermal Resistance of Insulation Sheet
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
What is a Thermal Model? (IGBT)
How to Use LTspice® Models
Calculation of Power Dissipation in Switching Circuit
4 Steps for Successful Thermal Designing of Power Devices
The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level
Notes for Temperature Measurement Using Thermocouples
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Judgment Criteria of Thermal Evaluation
About Export Administration Regulations (EAR)
Impedance Characteristics of Bypass Capacitor
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules
What Is Thermal Design
Generation Mechanism of Voltage Surge on Commutation Side (Basic)
Method for Monitoring Switching Waveform
How to Use LTspice® Models: Tips for Improving Convergence
Basics of Thermal Resistance and Heat Dissipation
Anti-Whisker formation
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Notes for Calculating Power Consumption:Static Operation
Package Dimensions
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Measurement Method and Usage of Thermal Resistance RthJC
Compliance of the ELV directive
Estimation of switching losses in IGBTs operating with resistive load
Moisture Sensitivity Level
Importance of Probe Calibration When Measuring Power: Deskew
About Flammability of Materials
Types and Features of Transistors
θ<sub>JA</sub> and Ψ<sub>JT</sub>
PCB Layout Thermal Design Guide
Precautions When Measuring the Rear of the Package with a Thermocouple
Part Explanation