R6524KNXC7G
ActiveRohm Semiconductor
650V 24A TO-220FM, HIGH-SPEED SWITCHING POWER MOSFET
R6524KNXC7G
ActiveRohm Semiconductor
650V 24A TO-220FM, HIGH-SPEED SWITCHING POWER MOSFET
Description
General part information
R6524KNX Series
R6524KNX is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.
Technical Specifications
Parameters and characteristics for this part
| Specification | R6524KNXC7G |
|---|---|
| Current - Continuous Drain (Id) (Tc) | 24 A |
| Drain to Source Voltage (Vdss) | 650 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 45 nC |
| Input Capacitance (Ciss) (Max) | 1850 pF, 1850 pF |
| Mounting Type | Through Hole |
| Operating Temperature | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FM |
| Power Dissipation (Max) | 74 W |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Technical Data Sheet EN
Measurement Method and Usage of Thermal Resistance RthJC
Method for Monitoring Switching Waveform
R6524KNX ESD Data
What is a Thermal Model? (Transistor)
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Types and Features of Transistors
Importance of Probe Calibration When Measuring Power: Deskew
How to Use LTspice® Models
Notes for Temperature Measurement Using Thermocouples
Notes for Calculating Power Consumption:Static Operation
Explanation for Marking
Package Dimensions
How to Use LTspice® Models: Tips for Improving Convergence
Compliance of the RoHS directive
Basics of Thermal Resistance and Heat Dissipation
Reliability Test Result
Judgment Criteria of Thermal Evaluation
What Is Thermal Design
PCB Layout Thermal Design Guide
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Moisture Sensitivity Level - Transistors
Calculation of Power Dissipation in Switching Circuit
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
List of Transistor Package Thermal Resistance
MOSFET Gate Resistor Setting for Motor Driving
Precautions When Measuring the Rear of the Package with a Thermocouple
θ<sub>JC</sub> and Ψ<sub>JT</sub>
MOSFET Gate Drive Current Setting for Motor Driving
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Anti-Whisker formation - Transistors
Two-Resistor Model for Thermal Simulation
Inner Structure
How to Create Symbols for PSpice Models
Part Explanation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Temperature derating method for Safe Operating Area (SOA)
About Flammability of Materials
Impedance Characteristics of Bypass Capacitor
About Export Regulations
θ<sub>JA</sub> and Ψ<sub>JT</sub>