IRL60HS118

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Infineon Technologies

OPTIMOS™ 5 N-CHANNEL POWER MOSFET 60 V ; PQFN 2 X 2 PACKAGE; 17 MOHM;

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IRL60HS118

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Infineon Technologies

OPTIMOS™ 5 N-CHANNEL POWER MOSFET 60 V ; PQFN 2 X 2 PACKAGE; 17 MOHM;

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	IRL60HS118

Current - Continuous Drain (Id) @ 25°C	18.5 A
Drain to Source Voltage (Vdss)	60 V
Drive Voltage (Max Rds On, Min Rds On)	10 V, 4.5 V
FET Type	N-Channel
Gate Charge (Qg) (Max) @ Vgs	8 nC
Mounting Type	Surface Mount
Operating Temperature [Max]	175 ░C
Operating Temperature [Min]	-55 °C
Package / Case	6-PowerVDFN
Power Dissipation (Max) [Max]	11.5 W
Rds On (Max) @ Id, Vgs	17 mOhm
Technology	MOSFET (Metal Oxide)
Vgs (Max)	20 V
Vgs(th) (Max) @ Id	2.3 V

IRL60HS118 Series

Part	Mounting Type	Vgs (Max)	Operating Temperature [Min]	Operating Temperature [Max]	Drain to Source Voltage (Vdss)	Current - Continuous Drain (Id) @ 25°C	Package / Case	Power Dissipation (Max) [Max]	FET Type	Gate Charge (Qg) (Max) @ Vgs	Technology	Vgs(th) (Max) @ Id	Rds On (Max) @ Id, Vgs	Drive Voltage (Max Rds On, Min Rds On)
Infineon Technologies IRL60HS118	Surface Mount	20 V	-55 °C	175 ░C	60 V	18.5 A	6-PowerVDFN	11.5 W	N-Channel	8 nC	MOSFET (Metal Oxide)	2.3 V	17 mOhm	4.5 V 10 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 1.34
		10	$ 0.84
		100	$ 0.56
		500	$ 0.44
		1000	$ 0.40
		2000	$ 0.36
	Digi-Reel®	1	$ 1.34
		10	$ 0.84
		100	$ 0.56
		500	$ 0.44
		1000	$ 0.40
		2000	$ 0.36
	Tape & Reel (TR)	4000	$ 0.34
		8000	$ 0.31
		12000	$ 0.31
Newark	Each (Supplied on Full Reel)	4000	$ 0.51
		8000	$ 0.50

Description

General part information

IRL60HS118 Series

Available in three different voltage classes (60 V, 80 V and 100 V), Infineon’snew logic level power MOSFETsare highly suitable forwireless charging,telecomandadapterapplications. The PQFN 2x2 package is especially suited for high speed switching and form factor critical applications. It enables higher power density and improved efficiency as well as significant space saving. VGS

Documents

Technical documentation and resources