TE0745-02-91C11-A
ObsoleteTrenz Electronic
SOM 1GB DDR3 XC7Z045-1FBG676C
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TE0745-02-91C11-A
ObsoleteTrenz Electronic
SOM 1GB DDR3 XC7Z045-1FBG676C
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | TE0745-02-91C11-A | TE0745 Series |
|---|---|---|
| - | - | |
| Co-Processor | - | Z-7030 |
| Co-Processor | - | Zynq-7000, Zynq-7000 (Z-7035) |
| Connector Type | Samtec ST5 | Samtec ST5 |
| Contents | - | Board(s) |
| Core Processor | Xilinx Zynq XC7Z045-1FBG676C | Xilinx Zynq XC7Z030-2FBG676I, ARM® Cortex®-A9, Xilinx Zynq XC7Z045-1FBG676C |
| Flash Size | 64 MB | 32 - 64 MB |
| For Use With/Related Products | - | TE0745 |
| Module/Board Type | MPU Core | MPU Core, FPGA, MCU |
| Operating Temperature [Max] | 70 °C | 70 - 85 °C |
| Operating Temperature [Min] | 0 °C | -40 - 0 °C |
| Platform | - | TE0745 Zynq-7000 AP SoC Carrier |
| RAM Size | 1 GB | 1 GB |
| Size / Dimension [x] | 52 mm | 52 mm |
| Size / Dimension [x] | 2.05 " | 2.05 " |
| Size / Dimension [y] | 2.99 in | 2.99 in |
| Size / Dimension [y] | 76 mm | 76 mm |
| Suggested Programming Environment | - | Vivado |
| Utilized IC / Part | - | TE0745 |
TE0745 Series
SOM 1GB DDR3 XC7Z030-2FBG676I
| Part | RAM Size | Size / Dimension [y] | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [x] | Connector Type | Flash Size | Core Processor | Operating Temperature [Max] | Operating Temperature [Min] | Module/Board Type | Co-Processor | Co-Processor | For Use With/Related Products | Contents | Platform | Utilized IC / Part | Suggested Programming Environment |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Trenz Electronic TE0745-02-72I11-A | 1 GB | 2.99 in | 76 mm | 52 mm | 2.05 " | Samtec ST5 | 64 MB | Xilinx Zynq XC7Z030-2FBG676I | 85 °C | -40 °C | MPU Core | |||||||
Trenz Electronic TE0745-02-92I11-A | ||||||||||||||||||
Trenz Electronic TE0745-02-71I11-A | 1 GB | 2.99 in | 76 mm | 52 mm | 2.05 " | Samtec ST5 | 64 MB | ARM® Cortex®-A9 | 85 °C | -40 °C | FPGA, MCU | Z-7030 | Zynq-7000 | |||||
Trenz Electronic TEB0745-02 | TE0745 | Board(s) | TE0745 Zynq-7000 AP SoC Carrier | TE0745 | Vivado | |||||||||||||
Trenz Electronic TE0745-02-81C11-A | 1 GB | 2.99 in | 76 mm | 52 mm | 2.05 " | Samtec ST5 | 32 MB | ARM® Cortex®-A9 | 85 °C | -40 °C | FPGA, MCU | Zynq-7000 (Z-7035) | ||||||
Trenz Electronic TE0745-02-91C11-A | 1 GB | 2.99 in | 76 mm | 52 mm | 2.05 " | Samtec ST5 | 64 MB | Xilinx Zynq XC7Z045-1FBG676C | 70 °C | 0 °C | MPU Core |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
TE0745 Series
TE0745 Embedded Module Xilinx Zynq XC7Z045-1FBG676C 1GB 64MB
Documents
Technical documentation and resources