SOM 1GB DDR3 XC7Z030-2FBG676I
| Part | RAM Size | Size / Dimension [y] | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [x] | Connector Type | Flash Size | Core Processor | Operating Temperature [Max] | Operating Temperature [Min] | Module/Board Type | Co-Processor | Co-Processor | For Use With/Related Products | Contents | Platform | Utilized IC / Part | Suggested Programming Environment |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Trenz Electronic TE0745-02-72I11-A | 1 GB | 2.99 in | 76 mm | 52 mm | 2.05 " | Samtec ST5 | 64 MB | Xilinx Zynq XC7Z030-2FBG676I | 85 °C | -40 °C | MPU Core | |||||||
Trenz Electronic TE0745-02-92I11-A | ||||||||||||||||||
Trenz Electronic TE0745-02-71I11-A | 1 GB | 2.99 in | 76 mm | 52 mm | 2.05 " | Samtec ST5 | 64 MB | ARM® Cortex®-A9 | 85 °C | -40 °C | FPGA, MCU | Z-7030 | Zynq-7000 | |||||
Trenz Electronic TEB0745-02 | TE0745 | Board(s) | TE0745 Zynq-7000 AP SoC Carrier | TE0745 | Vivado | |||||||||||||
Trenz Electronic TE0745-02-81C11-A | 1 GB | 2.99 in | 76 mm | 52 mm | 2.05 " | Samtec ST5 | 32 MB | ARM® Cortex®-A9 | 85 °C | -40 °C | FPGA, MCU | Zynq-7000 (Z-7035) | ||||||
Trenz Electronic TE0745-02-91C11-A | 1 GB | 2.99 in | 76 mm | 52 mm | 2.05 " | Samtec ST5 | 64 MB | Xilinx Zynq XC7Z045-1FBG676C | 70 °C | 0 °C | MPU Core |