
N3432-5202RB
Active3M (TC)
PIN HEADER, PCB HEADER, WIRE-TO-BOARD, 2.54 MM, 2 ROWS, 40 CONTACTS, THROUGH HOLE RIGHT ANGLE
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N3432-5202RB
Active3M (TC)
PIN HEADER, PCB HEADER, WIRE-TO-BOARD, 2.54 MM, 2 ROWS, 40 CONTACTS, THROUGH HOLE RIGHT ANGLE
Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | N3432-5202RB |
|---|---|
| Connector Type | Header |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Length - Mating | 6.1 mm |
| Contact Length - Mating [x] | 0.24 in |
| Contact Length - Post | 2.84 mm |
| Contact Length - Post | 0.112 in |
| Contact Material | Copper Alloy |
| Contact Shape | Square |
| Contact Type | Male Pin |
| Current Rating (Amps) | 1.75 A |
| Fastening Type | Latch Lock/Eject Hooks, Short |
| Insulation Color | Black |
| Insulation Height | 0.34 in |
| Insulation Height | 8.64 mm |
| Insulation Material | Polyester, Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole, Right Angle |
| Number of Positions | 40 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 105 ░C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Row Spacing - Mating [x] | 2.54 mm |
| Row Spacing - Mating [x] | 0.1 in |
| Shrouding | Shrouded - 4 Wall |
| Style | Board to Board, Cable |
| Termination | Solder |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
N3432 Series
The 3000 series Four-wall Header with copper alloy contacts and a glass-filled polycyclohexylenedimethylene terephthalate insulator. The high temperature insulator suitable for no lead soldering operations. It is suitable for reflow soldering using paste in hole techniques.
Documents
Technical documentation and resources