TSM-108-01-H-DH

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Samtec Inc.

CONN HEADER SMD R/A 16POS 2.54MM

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TSM-108-01-H-DH

Active

Samtec Inc.

CONN HEADER SMD R/A 16POS 2.54MM

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DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TSM-108-01-H-DH

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Mating	5.84 mm
Contact Length - Mating [x]	0.23 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.24 in
Insulation Height	6.1 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount, Right Angle
Number of Positions	16
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

TSM-108 Series

...

Part	Insulation Color	Number of Positions Loaded	Contact Material	Contact Shape	Material Flammability Rating	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Insulation Height	Insulation Height	Number of Positions	Fastening Type	Number of Rows	Connector Type	Pitch - Mating	Pitch - Mating	Shrouding	Insulation Material	Contact Length - Mating [x]	Contact Length - Mating	Contact Type	Features	Termination	Contact Finish - Post	Style	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Length - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions	Number of Positions Loaded
Samtec Inc. TSM-108-01-T-DV-A-P	Black	All	Phosphor Bronze	Square	UL94 V-0	105 ░C	-55 °C	Surface Mount	2.54 mm	0.1 in	0.1 in	2.54 mm	16	Push-Pull	2	Cuttable Header	0.1 in	2.54 mm	Unshrouded	Liquid Crystal Polymer (LCP)	0.23 in	5.84 mm	Male Pin	Board Guide Pick and Place	Solder	Tin	Board to Board Cable
Samtec Inc. TSM-108-01-S-DH-LC-P-TR	Black	All	Phosphor Bronze	Square	UL94 V-0	125 °C	-55 °C	Surface Mount Right Angle	2.54 mm	0.1 in	0.24 in	6.1 mm	16	Push-Pull	2	Header	0.1 in	2.54 mm	Unshrouded	Liquid Crystal Polymer (LCP)	0.23 in	5.84 mm	Male Pin	Board Lock Pick and Place	Solder	Tin	Board to Board Cable	Gold	30 Áin	0.76 Ám
Samtec Inc. TSM-108-02-LM-DH-SL-K-TR	Black	All	Phosphor Bronze	Square	UL94 V-0	125 °C	-55 °C	Surface Mount Right Angle	2.54 mm	0.1 in	0.24 in	6.1 mm	16	Push-Pull	2	Header	0.1 in	2.54 mm	Unshrouded	Liquid Crystal Polymer (LCP)		8.13 mm	Male Pin	Pick and Place Solder Retention	Solder	Tin	Board to Board Cable	Gold	10 çin	0.25 çm	0.32 in
Samtec Inc. TSM-108-01-H-DH	Black	All	Phosphor Bronze	Square	UL94 V-0	125 °C	-55 °C	Surface Mount Right Angle	2.54 mm	0.1 in	0.24 in	6.1 mm	16	Push-Pull	2	Header	0.1 in	2.54 mm	Unshrouded	Liquid Crystal Polymer (LCP)	0.23 in	5.84 mm	Male Pin		Solder	Gold	Board to Board Cable	Gold	30 Áin	0.76 Ám		3 µin	0.076 µm
Samtec Inc. TSM-108-02-T-DV-TR	Black	All	Phosphor Bronze	Square	UL94 V-0	105 ░C	-55 °C	Surface Mount	2.54 mm	0.1 in	0.1 in	2.54 mm	16	Push-Pull	2	Cuttable Header	0.1 in	2.54 mm	Unshrouded	Liquid Crystal Polymer (LCP)		8.13 mm	Male Pin		Solder	Tin	Board to Board Cable				0.32 in
Samtec Inc. TSM-108-02-F-SV-A	Black	All	Phosphor Bronze	Square	UL94 V-0	125 °C	-55 °C	Surface Mount			0.1 in	2.54 mm		Push-Pull	1	Cuttable Header	0.1 in	2.54 mm	Unshrouded	Liquid Crystal Polymer (LCP)		8.13 mm	Male Pin	Board Guide	Solder	Tin	Board to Board Cable	Gold	3 µin	0.076 µm	0.32 in			8
Samtec Inc. TSM-108-02-SM-DV-TR	Black	All	Phosphor Bronze	Square	UL94 V-0	125 °C	-55 °C	Surface Mount	2.54 mm	0.1 in	0.1 in	2.54 mm	16	Push-Pull	2	Cuttable Header	0.1 in	2.54 mm	Unshrouded	Liquid Crystal Polymer (LCP)		8.13 mm	Male Pin		Solder	Tin	Board to Board Cable	Gold	30 Áin	0.76 Ám	0.32 in
Samtec Inc. TSM-108-02-L-DH-SL	Black	All	Phosphor Bronze	Square	UL94 V-0	125 °C	-55 °C	Surface Mount Right Angle	2.54 mm	0.1 in	0.24 in	6.1 mm	16	Push-Pull	2	Header	0.1 in	2.54 mm	Unshrouded	Liquid Crystal Polymer (LCP)		8.13 mm	Male Pin	Solder Retention	Solder	Tin	Board to Board Cable	Gold	10 çin	0.25 çm	0.32 in
Samtec Inc. TSM-108-01-G-SV-005	Black		Phosphor Bronze	Square	UL94 V-0	125 °C	-55 °C	Surface Mount			0.1 in	2.54 mm		Push-Pull	1	Cuttable Header	0.1 in	2.54 mm	Unshrouded	Liquid Crystal Polymer (LCP)	0.23 in	5.84 mm	Male Pin		Solder	Gold	Board to Board Cable	Gold	10 çin	0.25 çm		3 µin	0.076 µm	8	7
Samtec Inc. TSM-108-01-S-DH-A-003-P-TR	Black		Phosphor Bronze	Square	UL94 V-0	125 °C	-55 °C	Surface Mount Right Angle	2.54 mm	0.1 in	0.24 in	6.1 mm	16	Push-Pull	2	Header	0.1 in	2.54 mm	Unshrouded	Liquid Crystal Polymer (LCP)	0.23 in	5.84 mm	Male Pin	Board Guide Pick and Place	Solder	Tin	Board to Board Cable	Gold	30 Áin	0.76 Ám					15

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 3.71

Description

General part information

TSM-108 Series

Connector Header Surface Mount, Right Angle 16 position 0.100" (2.54mm)

Documents

Technical documentation and resources