Zenode.ai Logo
ROHM SCT3080KW7TL

SCT3080AW7TL

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 29 A, 650 V, 0.08 OHM, TO-263 (D2PAK)

Find alt
ROHM SCT3080KW7TL

SCT3080AW7TL

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 29 A, 650 V, 0.08 OHM, TO-263 (D2PAK)

Find alt

Description

General part information

SCT3080 Series

SCT3080KR is anSiC MOSFETfeaturing a trench gate structure optimized for server power supplies, solar power inverters, andEV charging stationsrequiring high efficiency. A new 4-pin package is used that separates the power and driver source terminals, making it possible to maximize high-speed switching performance. This improves turn ON loss in particular, and as a result the total turn ON and turn OFF losses can be reduced by as much as 35% compared with the conventional 3-pin package (TO-247N).A pioneer and industry leader in SiC technology, ROHM was the first supplier to mass produce trench-type MOSFETs that further improve efficiency while reducing power consumption over existing SiC MOSFETs.

Technical Specifications

Parameters and characteristics for this part

SpecificationSCT3080AW7TL
Current - Continuous Drain (Id) (Tc)29 A
Drain to Source Voltage (Vdss)650 V
FET TypeN-Channel
Gate Charge (Max)48 nC
Input Capacitance (Ciss) (Max)571 pF
Mounting TypeSurface Mount
Operating Temperature175 °C
Package Leads7 Leads
Package NameTO-263-7, D2PAK
Power Dissipation (Max)125 W
Rds On (Max)104 mOhm
TechnologySiCFET (Silicon Carbide)
Vgs (Max) Negative-4 V
Vgs (Max) Positive22 V
Vgs(th) (Max)5.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Sign in to see pricing

Create a free account to access distributor pricing data.

CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
Notes on Gate Drive Voltage Setting and Linear Mode Application of SiC MOSFET
Best practices for the connection of Driver Source/Emitter terminals in discrete devices
Oscillation countermeasures for MOSFETs in parallel
About Flammability of Materials
Precautions during gate-source voltage measurement for SiC MOSFET
What is a Thermal Model? (SiC Power Device)
How to Use LTspice® Models: Tips for Improving Convergence
Gate-source voltage behaviour in a bridge configuration
Judgment Criteria of Thermal Evaluation
5kW High-Efficiency Fan-less Inverter
TO-263-7L Inner Structure
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
PCB Layout Thermal Design Guide
Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules
Application Note for SiC Power Devices and Modules
How to Use PSIM Models
Notes for Temperature Measurement Using Thermocouples
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Generation Mechanism of Voltage Surge on Commutation Side (Basic)
Part Explanation
TO-263-7L Explanation for Marking
How to Create Symbols for PSpice Models
Gate-Source Voltage Surge Suppression Methods
Measurement Method and Usage of Thermal Resistance RthJC
TO-263-7L Package Dimensions
How to Suppress the Parallel Drive Oscillation in SiC Modules
LEADRIVE: Design, Test and System Evaluation of Silicon Carbide Power Modules and Motor Control Units
Improvement of switching loss by driver source
Precautions for Thermal Resistance of Insulation Sheet
Precautions When Measuring the Rear of the Package with a Thermocouple
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Calculating Power Loss from Measured Waveforms
Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs
Anti-Whisker formation
Condition of Soldering
SiC MOSFET Layout Design Considerations
How to Use PLECS Models
Solving the challenges of driving SiC MOSFETs with new packaging developments
Design Method for Comparator-less Miller Clamp Circuits
How to measure the oscillation occurs between parallel-connected devices
Two-Resistor Model for Thermal Simulation
Notes for Calculating Power Consumption:Static Operation
Impedance Characteristics of Bypass Capacitor
Method for Monitoring Switching Waveform
TO-263-7L Taping Information
Calculation of Power Dissipation in Switching Circuit
Types and Features of Transistors
Basics of Thermal Resistance and Heat Dissipation
4 Steps for Successful Thermal Designing of Power Devices
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Snubber circuit design methods for SiC MOSFET
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Importance of Probe Calibration When Measuring Power: Deskew
θ<sub>JC</sub> and Ψ<sub>JT</sub>
About Export Administration Regulations (EAR)
Moisture Sensitivity Level
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
Compliance of the ELV directive
Thermal Resistance Measurement Method for SiC MOSFET
The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level
Basics and Design Guidelines for Gate Drive Circuits
How to Use Thermal Models
How to Use LTspice&reg; Models
How to Use the Thermal Resistance and Thermal Characteristics Parameters
800V Three-Phase Output LLC DC/DC Resonant Converter
What Is Thermal Design