RF6L025BGTCR
ActiveRohm Semiconductor
MOSFET, N-CH, 60V, 2.5A, SOT-363T ROHS COMPLIANT: YES
RF6L025BGTCR
ActiveRohm Semiconductor
MOSFET, N-CH, 60V, 2.5A, SOT-363T ROHS COMPLIANT: YES
Description
General part information
RF6L025BG Series
RF6L025BG is a power MOSFET with low on-resistance and high power small mold package, suitable for Switching, Motor drives, and DC/DC converter applications.
Technical Specifications
Parameters and characteristics for this part
| Specification | RF6L025BGTCR |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 2.5 A |
| Drain to Source Voltage (Vdss) | 60 V |
| Drive Voltage (Max Rds On) | 4.5 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 3.1 nC |
| Input Capacitance (Ciss) (Max) | 135 pF |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | Flat Leads, 6-SMD |
| Package Name | TUMT6 |
| Power Dissipation (Max) | 910 mW |
| Rds On (Max) | 91 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 2.5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Explanation for Marking
Calculation of Power Dissipation in Switching Circuit
List of Transistor Package Thermal Resistance
Importance of Probe Calibration When Measuring Power: Deskew
RF6L025BG Data Sheet
Impedance Characteristics of Bypass Capacitor
Compliance of the RoHS directive
What Is Thermal Design
RF6L025BG ESD Data
Condition of Soldering / Land Pattern Reference
Moisture Sensitivity Level - Transistors
Types and Features of Transistors
What is a Thermal Model? (Transistor)
MOSFET Gate Resistor Setting for Motor Driving
Precautions When Measuring the Rear of the Package with a Thermocouple
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
How to Use LTspice® Models: Tips for Improving Convergence
Package Dimensions
Part Explanation
Basics of Thermal Resistance and Heat Dissipation
PCB Layout Thermal Design Guide
Notes for Calculating Power Consumption:Static Operation
Temperature derating method for Safe Operating Area (SOA)
Taping Information
MOSFET Gate Drive Current Setting for Motor Driving
Two-Resistor Model for Thermal Simulation
Method for Monitoring Switching Waveform
Notes for Temperature Measurement Using Thermocouples
About Export Regulations
How to Use LTspice® Models
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Measurement Method and Usage of Thermal Resistance RthJC
About Flammability of Materials
Anti-Whisker formation - Transistors
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Certificate of not containing SVHC under REACH Regulation