
RF4E110GNTR
ActiveRohm Semiconductor
MOSFET, N-CH, 30V, 11A, HUML2020

RF4E110GNTR
ActiveRohm Semiconductor
MOSFET, N-CH, 30V, 11A, HUML2020
Description
General part information
RF4E110 Series
Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.
Technical Specifications
Parameters and characteristics for this part
| Specification | RF4E110GNTR |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 11 A |
| Drain to Source Voltage (Vdss) | 30 V |
| Drive Voltage (Max Rds On) | 4.5 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 7.4 nC |
| Input Capacitance (Ciss) (Max) | 504 pF |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | 8-PowerUDFN |
| Package Name | HUML2020L8 |
| Power Dissipation (Max) | 2 W |
| Rds On (Max) | 11.3 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 2.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Technical Data Sheet EN
Compliance of the RoHS directive
Package Dimensions
Moisture Sensitivity Level - Transistors
What is a Thermal Model? (Transistor)
Method for Monitoring Switching Waveform
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Temperature derating method for Safe Operating Area (SOA)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
ESD Data
Measurement Method and Usage of Thermal Resistance RthJC
Basics of Thermal Resistance and Heat Dissipation
Part Explanation
Impedance Characteristics of Bypass Capacitor
Condition of Soldering / Land Pattern Reference
Certificate of not containing SVHC under REACH Regulation
Anti-Whisker formation - Transistors
Types and Features of Transistors
How to Use LTspice® Models: Tips for Improving Convergence
Importance of Probe Calibration When Measuring Power: Deskew
Notes for Calculating Power Consumption:Static Operation
Precautions When Measuring the Rear of the Package with a Thermocouple
MOSFET Gate Drive Current Setting for Motor Driving
PCB Layout Thermal Design Guide
About Export Regulations
List of Transistor Package Thermal Resistance
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Notes for Temperature Measurement Using Thermocouples
What Is Thermal Design
MOSFET Gate Resistor Setting for Motor Driving
Two-Resistor Model for Thermal Simulation
Calculation of Power Dissipation in Switching Circuit
How to Use LTspice® Models
How to Create Symbols for PSpice Models
Inner Structure
Explanation for Marking
Taping Information
About Flammability of Materials