WB75FC65ALZ

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WeEn Semiconductors

WB75FC65AL/NAU000/NO MARK*CHIPS

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WeEn Semiconductors

WB75FC65AL/NAU000/NO MARK*CHIPS

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	WB75FC65ALZ	WB75 Series

Current - Average Rectified (Io)	75 A	75 A
Current - Reverse Leakage @ Vr	10 µA	10 - 250 µA
Mounting Type	Surface Mount	Surface Mount
Operating Temperature - Junction	175 °C	175 °C
Package / Case	Die	Die
Reverse Recovery Time (trr)	50 ns	50 - 85 ns
Speed	200 mA, 500 ns	200 - 500 mA
Supplier Device Package	Wafer	Wafer
Technology	Standard	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	650 V	1.2 - 650 kV
Voltage - Forward (Vf) (Max) @ If	2.75 V	2.75 - 3.3 V

WB75FC120AL/NAU000/NO MARK*CHIPS

Part	Package / Case	Mounting Type	Voltage - DC Reverse (Vr) (Max) [Max]	Supplier Device Package	Operating Temperature - Junction	Reverse Recovery Time (trr)	Speed	Voltage - Forward (Vf) (Max) @ If	Current - Average Rectified (Io)	Current - Reverse Leakage @ Vr	Technology
WeEn Semiconductors WB75FC120ALZ	Die	Surface Mount	1.2 kV	Wafer	175 °C	85 ns	200 mA, 500 ns	3.3 V	75 A	250 µA	Standard
WeEn Semiconductors WB75FC65ALZ	Die	Surface Mount	650 V	Wafer	175 °C	50 ns	200 mA, 500 ns	2.75 V	75 A	10 µA	Standard

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	426	$ 1.13

General part information

Diode 650 V 75A Surface Mount Wafer

Technical documentation and resources

No documents available