08-2823-90T

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Aries Electronics

CONN IC DIP SOCKET 8POS TIN

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Aries Electronics

CONN IC DIP SOCKET 8POS TIN

Technical Specifications

Parameters and characteristics for this part

Specification	08-2823-90T

Contact Finish - Post	Tin
Contact Finish Thickness - Mating	5.08 µm
Contact Finish Thickness - Mating	200 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Phosphor Bronze
Contact Material - Post	Phosphor Bronze
Current Rating (Amps)	1.5 A
Features	Closed Frame
Housing Material	Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Number of Positions or Pins (Grid)	8
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.145 "
Termination Post Length	3.68 mm
Type	DIP
Type	5.08 mm
Type	0.2 in

Part	Housing Material	Contact Material - Post	Features	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Pitch - Post	Pitch - Post	Current Rating (Amps)	Contact Finish - Post	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Material - Mating
Aries Electronics 08-2823-90T	Polyamide (PA46) Nylon 4/6	Phosphor Bronze	Closed Frame	DIP	5.08 mm	0.2 in	5.08 µm	200 µin	Solder	2.54 mm	0.1 in	1.5 A	Tin	UL94 V-0	200 µin	5.08 µm	8	0.145 "	3.68 mm	0.1 in	2.54 mm	Phosphor Bronze

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	151	$ 3.35

General part information

8 (2 x 4) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Tin Through Hole, Right Angle, Horizontal

Technical documentation and resources