RB095T-60HZC9
ActiveRohm Semiconductor
SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)
RB095T-60HZC9
ActiveRohm Semiconductor
SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)
Description
General part information
RB095T-60HZ Series
RB095T-60HZ is low IRand high reliability Automotive schottky barrier diode for switching power supply.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB095T-60HZC9 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 3 A |
| Current - Reverse Leakage | 300 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Grade | Automotive |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FN |
| Qualification | AEC-Q101 |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 60 V |
| Voltage - Forward (Vf) (Max) | 580 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Method for Monitoring Switching Waveform
RB095T-60HZ Data Sheet
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Compliance of the RoHS directive
Power Loss and Thermal Design of Diodes
RB095T-60HZ ESD Data
Reliability Test Result
About Flammability of Materials
Impedance Characteristics of Bypass Capacitor
How to Select Reverse Current Protection Diodes for LDO Regulators
Absolute Maximum Rating and Electrical Characteristics of Diodes
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
PCB Layout Thermal Design Guide
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
About Export Regulations
Certificate of not containing SVHC under REACH Regulation
How to Use LTspice® Models: Tips for Improving Convergence
Two-Resistor Model for Thermal Simulation
Taping Information
Notes for Calculating Power Consumption:Static Operation
Condition of Soldering / Land Pattern Reference
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Importance of Probe Calibration When Measuring Power: Deskew
Package Dimensions
What is a Thermal Model? (Diode)
Anti-Whisker formation - Diodes
Measurement Method and Usage of Thermal Resistance RthJC
Precautions When Measuring the Rear of the Package with a Thermocouple
Notes for Temperature Measurement Using Thermocouples
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Moisture Sensitivity Level - Diodes
Judgment Criteria of Thermal Evaluation
Diode Types and Applications
How to Select Rectifier Diodes
How to Use LTspice® Models
Diode Selection Method for Asynchronous Converter
List of Diode Package Thermal Resistance
Explanation for Marking
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
What Is Thermal Design
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Inner Structure
Basics of Thermal Resistance and Heat Dissipation
Part Explanation
Constitution Materials List