RUM001L02T2CL
ActiveRohm Semiconductor
POWER MOSFET, N CHANNEL, 20 V, 100 MA, 2.5 OHM, VMT, SURFACE MOUNT
RUM001L02T2CL
ActiveRohm Semiconductor
POWER MOSFET, N CHANNEL, 20 V, 100 MA, 2.5 OHM, VMT, SURFACE MOUNT
Description
General part information
RUM001L02 Series
MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.
Technical Specifications
Parameters and characteristics for this part
| Specification | RUM001L02T2CL |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 100 mA |
| Drain to Source Voltage (Vdss) | 20 V |
| FET Type | N-Channel |
| Input Capacitance (Ciss) (Max) | 7.1 pF |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | SOT-723 |
| Package Name | VMT3 |
| Power Dissipation (Max) | 150 mW |
| Rds On (Max) | 3.5 Ohm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 8 V |
| Vgs(th) (Max) | 1 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Inner Structure
MOSFET Gate Resistor Setting for Motor Driving
MOSFET Gate Drive Current Setting for Motor Driving
Method for Monitoring Switching Waveform
What is a Thermal Model? (Transistor)
Certificate of not containing SVHC under REACH Regulation
PCB Layout Thermal Design Guide
About Export Regulations
List of Transistor Package Thermal Resistance
Package Dimensions
Compliance of the RoHS directive
Explanation for Marking
Basics of Thermal Resistance and Heat Dissipation
Part Explanation
Measurement Method and Usage of Thermal Resistance RthJC
Reliability Test Result
Importance of Probe Calibration When Measuring Power: Deskew
About Flammability of Materials
How to Use LTspice® Models
What Is Thermal Design
How to Create Symbols for PSpice Models
Types and Features of Transistors
Calculation of Power Dissipation in Switching Circuit
RUM001L02 Data Sheet
ESD Data
Anti-Whisker formation - Transistors
Condition of Soldering / Land Pattern Reference
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Precautions When Measuring the Rear of the Package with a Thermocouple
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Notes for Temperature Measurement Using Thermocouples
Taping Information
Moisture Sensitivity Level - Transistors
Two-Resistor Model for Thermal Simulation
How to Use LTspice® Models: Tips for Improving Convergence
Impedance Characteristics of Bypass Capacitor
Notes for Calculating Power Consumption:Static Operation
Temperature derating method for Safe Operating Area (SOA)