Specification	R7F7016523ABG-C#HC1

A/D Channels	38 count, 32 count
A/D Resolution (bits)	10 bit, 12 bit
Connectivity	USART, CSIO, Ethernet, UART, CANbus, LINbus, I2C, SPI
Core Processor	RH850G3KH
Core Size (Bit Width)	32 Bit
EEPROM Size (Depth)	128 K
EEPROM Size (Width)	8 bit
Mounting Type	Surface Mount
Number of I/O	214
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package / Case	272-FBGA
Package Length	17 mm
Package Name	272-FBGA
Package Width	17 mm
Peripherals	DMA, LVD, PWM, WDT
Program Memory Depth	3 M
Program Memory Size	3 MB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	384 K
RAM Size Width	8 bit
Speed	240 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	3 V

R7F7016523 Series

Part	Program Memory Type	Package Name	Package Width	Package Length	Program Memory Width	Program Memory Depth	Program Memory Size	A/D Resolution (bits)	A/D Channels	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Core Size (Bit Width)	Number of I/O	Package / Case	Oscillator Type	Connectivity	Speed	RAM Size Width	RAM Size Depth	Operating Temperature (Max)	Operating Temperature (Min)	Peripherals	Core Processor	EEPROM Size (Width)	EEPROM Size (Depth)	Mounting Type
Renesas Electronics Corporation R7F7016523ABG-C#HC1	FLASH	272-FBGA	17 mm	17 mm	8 bit	3 M	3 MB	10 bit 12 bit	32 count 38 count	3 V	5.5 V	32 Bit	214	272-FBGA	Internal	CANbus CSIO Ethernet I2C LINbus SPI UART USART	240 MHz	8 bit	384 K	105 °C	-40 °C	DMA LVD PWM WDT	RH850G3KH	8 bit	128 K	Surface Mount

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