2SB1694T106
ActiveRohm Semiconductor
PNP, SOT-323, -30V -1A, LOW VCE(SAT) TRANSISTOR
2SB1694T106
ActiveRohm Semiconductor
PNP, SOT-323, -30V -1A, LOW VCE(SAT) TRANSISTOR
Description
General part information
2SB1694 Series
Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.
Technical Specifications
Parameters and characteristics for this part
| Specification | 2SB1694T106 |
|---|---|
| Current - Collector (Ic) (Max) | 1 A |
| Current - Collector Cutoff (Max) | 100 nA |
| DC Current Gain (hFE) (Min) | 270 |
| Frequency - Transition | 320 MHz |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | SC-70, SOT-323 |
| Package Name | UMT3 |
| Power - Max | 200 mW |
| Transistor Type | PNP |
| Vce Saturation (Max) | 380 mV |
| Voltage - Collector Emitter Breakdown (Max) | 30 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
UMT3 Part Marking
UMT3 T106 Taping Spec
Transistor, MOSFET Flammability
What is a Thermal Model? (Transistor)
Calculation of Power Dissipation in Switching Circuit
Notes for Calculating Power Consumption:Static Operation
Method for Monitoring Switching Waveform
Anti-Whisker formation - Transistors
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Notes for Temperature Measurement Using Thermocouples
List of Transistor Package Thermal Resistance
ESD Data
Measurement Method and Usage of Thermal Resistance RthJC
Condition of Soldering / Land Pattern Reference
Inner Structure
Part Explanation
How to Use LTspice® Models
Types and Features of Transistors
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Package Dimensions
Reliability Test Result
Precautions When Measuring the Rear of the Package with a Thermocouple
What Is Thermal Design
Certificate of not containing SVHC under REACH Regulation
Impedance Characteristics of Bypass Capacitor
Temperature derating method for Safe Operating Area (SOA)
Importance of Probe Calibration When Measuring Power: Deskew
Two-Resistor Model for Thermal Simulation
How to Use LTspice® Models: Tips for Improving Convergence
How to Create Symbols for PSpice Models
Moisture Sensitivity Level - Transistors
Basics of Thermal Resistance and Heat Dissipation
About Export Regulations
PCB Layout Thermal Design Guide
Compliance of the RoHS directive