637-M26-230-BN1

Active

EDAC Inc.

D SUB CONNECTOR, HIGH DENSITY, PLUG, 637M SERIES, 26 CONTACTS, DA, SOLDER

637-M26-230-BN1

Active

EDAC Inc.

D SUB CONNECTOR, HIGH DENSITY, PLUG, 637M SERIES, 26 CONTACTS, DA, SOLDER

Description Specifications Series Pricing CAD Documents

Description

General part information

637M Series

D SUB CONNECTOR, HIGH DENSITY, PLUG, 637M SERIES, 26 CONTACTS, DA, SOLDER

Technical Specifications

Parameters and characteristics for this part

Specification	637-M26-230-BN1

Connector Layout	DA, A, High Density
Connector Style	High Density, D-Sub
Connector Type	Male Pins, Plug
Contact Finish	Gold
Contact Finish Thickness	0
Contact Finish Thickness	Flash
Contact Finish Thickness (string set options)	Flash
Contact Type	Signal
Current Rating (Per Contact)	5 A
Features	Shielded, Grounding Indents
Finish	Nickel Plated
Flange Feature	Shell (Unthreaded), Housing
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	26
Number of Rows	3
Shell Material	Steel
Shell Size	2
Termination	Solder

637M Series

Part	Material Flammability Rating	Connector Style	Contact Finish	Contact Type	Termination	Shell Size	Connector Layout	Features	Contact Finish Thickness	Contact Finish Thickness (string set options)	Contact Finish Thickness	Flange Feature	Connector Type	Mounting Type	Current Rating (Per Contact)	Shell Material	Finish	Number of Positions	Number of Rows
EDAC Inc. 637-M15-230-BN5	UL94 V-0	D-Sub High Density	Gold	Signal	Solder	1	DE E High Density	Board Lock Grounding Indents Shielded	0	Flash	Flash	Housing Shell (4-40)	Male Pins Plug	Through Hole	5 A	Steel	Nickel Plated	15	3
EDAC Inc. 637-M62-632-BT1	UL94 V-0	D-Sub High Density	Gold	Signal	Solder Cup	4	C DC High Density	Grounding Indents Shielded	30 µin			Housing Shell (Unthreaded)	Male Pins Plug	Free Hanging (In-Line)	5 A	Steel	Tin Plated	62	3
EDAC Inc. 637-M44-630-BN6	UL94 V-0	D-Sub High Density	Gold	Signal	Solder	3	B DB High Density	Board Lock Grounding Indents Shielded	30 µin			Housing Shell (4-40)	Male Pins Plug	Through Hole	5 A	Steel	Nickel Plated	44	3
EDAC Inc. 637-M26-232-BT3	UL94 V-0	D-Sub High Density	Gold	Signal	Solder Cup	2	A DA High Density	Grounding Indents Shielded	0	Flash	Flash	Housing Shell (4-40)	Male Pins Plug	Free Hanging (In-Line)	5 A	Steel	Tin Plated	26	3
EDAC Inc. 637-M15-230-BT3	UL94 V-0	D-Sub High Density	Gold	Signal	Solder	1	DE E High Density	Grounding Indents Shielded	0	Flash	Flash	Housing Shell (4-40)	Male Pins Plug	Through Hole	5 A	Steel	Tin Plated	15	3
EDAC Inc. 637-M44-330-BT4	UL94 V-0	D-Sub High Density	Gold	Signal	Solder	3	B DB High Density	Grounding Indents Shielded	15 µin			Housing Shell (4-40)	Male Pins Plug	Through Hole	5 A	Steel	Tin Plated	44	3
EDAC Inc. 637-M15-630-BT2	UL94 V-0	D-Sub High Density	Gold	Signal	Solder	1	DE E High Density	Grounding Indents Shielded	30 µin			Housing Shell (4-40)	Male Pins Plug	Through Hole	5 A	Steel	Tin Plated	15	3
EDAC Inc. 637-M26-230-BN1	UL94 V-0	D-Sub High Density	Gold	Signal	Solder	2	A DA High Density	Grounding Indents Shielded	0	Flash	Flash	Housing Shell (Unthreaded)	Male Pins Plug	Through Hole	5 A	Steel	Nickel Plated	26	3
EDAC Inc. 637-M26-230-BT2	UL94 V-0	D-Sub High Density	Gold	Signal	Solder	2	A DA High Density	Grounding Indents Shielded	0	Flash	Flash	Housing Shell (4-40)	Male Pins Plug	Through Hole	5 A	Steel	Tin Plated	26	3
EDAC Inc. 637-M15-330-BT1	UL94 V-0	D-Sub High Density	Gold	Signal	Solder	1	DE E High Density	Grounding Indents Shielded	15 µin			Housing Shell (Unthreaded)	Male Pins Plug	Through Hole	5 A	Steel	Tin Plated	15	3