Specification	SM912F634DV2AER2

A/D Channels	15 count
A/D Resolution (bits)	10 bit
Connectivity	LINbus, SPI, SCI
Core Processor	S12
Core Size (Bit Width)	16 Bit
Mounting Type	Surface Mount
Number of I/O	3
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package / Case	48-LQFP Exposed Pad
Package Length	7 mm
Package Name	48-HLQFP
Package Width	7 mm
Peripherals	WDT, POR, PWM
Program Memory Depth	32 K
Program Memory Size	32 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	2 K
RAM Size Width	8 bit
Speed	20 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	4.5 V

SM912F634 Series

Part	Package / Case	Connectivity	Number of I/O	A/D Resolution (bits)	A/D Channels	Oscillator Type	Peripherals	Operating Temperature (Max)	Operating Temperature (Min)	Program Memory Type	Program Memory Size	Program Memory Width	Program Memory Depth	Mounting Type	Core Size (Bit Width)	RAM Size Depth	RAM Size Width	Speed	Package Length	Package Name	Package Width	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	Core Processor
NXP USA Inc. SM912F634DV2AE	48-LQFP Exposed Pad	LINbus SCI SPI	3	10 bit	15 count	Internal	POR PWM WDT	105 °C	-40 °C	FLASH	32 KB	8 bit	32 K	Surface Mount	16 Bit	2 K	8 bit	20 MHz	7 mm	48-HLQFP	7 mm	5.5 V	4.5 V	S12
NXP USA Inc. SM912F634DV2AER2	48-LQFP Exposed Pad	LINbus SCI SPI	3	10 bit	15 count	Internal	POR PWM WDT	105 °C	-40 °C	FLASH	32 KB	8 bit	32 K	Surface Mount	16 Bit	2 K	8 bit	20 MHz	7 mm	48-HLQFP	7 mm	5.5 V	4.5 V	S12

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