10-350000-10-HT

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Aries Electronics

10P SOP PLUGIN IC / TRANSISTOR SOCKET

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Aries Electronics

10P SOP PLUGIN IC / TRANSISTOR SOCKET

Technical Specifications

Parameters and characteristics for this part

Specification	10-350000-10-HT

Board Material	Polyimide (PI)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	SOIC
Convert To (Adapter End)	0.3 in
Convert To (Adapter End)	DIP
Convert To (Adapter End)	7.62 mm
Mounting Type	Through Hole
Number of Pins	10
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in

Part	Pitch [x]	Pitch [x]	Board Thickness	Board Thickness	Board Thickness	Number of Positions	Proto Board Type	Material	Contact Finish - Post	Pitch - Post	Pitch - Post	Board Material	Convert From (Adapter End)	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Mounting Type	Termination	Pitch - Mating	Pitch - Mating	Number of Pins	Contact Material - Post [custom]
Aries Electronics 10-350000-10	0.05 in	1.27 mm	0.062 in	0.0625 in	1.57 mm	10	SMD to DIP	FR4 Epoxy Glass
Aries Electronics 10-350000-10-HT									Tin-Lead	2.54 mm	0.1 in	Polyimide (PI)	SOIC	3.18 mm	0.125 in	200 µin	5.08 µm	0.3 in	DIP	7.62 mm	Through Hole	Solder	0.05 in	1.27 mm	10	Brass

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly