RSR025N03HZGTL
ActiveRohm Semiconductor
TRANS MOSFET N-CH 30V 2.5A 3-PIN TSMT T/R AUTOMOTIVE AEC-Q101
RSR025N03HZGTL
ActiveRohm Semiconductor
TRANS MOSFET N-CH 30V 2.5A 3-PIN TSMT T/R AUTOMOTIVE AEC-Q101
Description
General part information
RSR025N03HZG Series
RSR025N03HZG is a MOSFET with low on - resistance, suitable for switching.
Technical Specifications
Parameters and characteristics for this part
| Specification | RSR025N03HZGTL |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 2.5 A |
| Drain to Source Voltage (Vdss) | 30 V |
| Drive Voltage (Max Rds On) | 4 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 4.1 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 165 pF |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | SC-96 |
| Package Name | TSMT3 |
| Power Dissipation (Max) | 700 mW |
| Qualification | AEC-Q101 |
| Rds On (Max) | 70 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 2.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Technical Data Sheet EN
RSR025N03HZGTL | Datasheet
Inner Structure
Reliability Test Result
Package Dimensions
RSR025N03HZG ESD Data
Notes for Calculating Power Consumption:Static Operation
Basics of Thermal Resistance and Heat Dissipation
PCB Layout Thermal Design Guide
Calculation of Power Dissipation in Switching Circuit
Precautions When Measuring the Rear of the Package with a Thermocouple
What Is Thermal Design
MOSFET Gate Drive Current Setting for Motor Driving
Impedance Characteristics of Bypass Capacitor
Explanation for Marking
How to Create Symbols for PSpice Models
What is a Thermal Model? (Transistor)
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Notes for Temperature Measurement Using Forward Voltage of PN Junction
List of Transistor Package Thermal Resistance
Part Explanation
Importance of Probe Calibration When Measuring Power: Deskew
Condition of Soldering / Land Pattern Reference
Temperature derating method for Safe Operating Area (SOA)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Notes for Temperature Measurement Using Thermocouples
Types and Features of Transistors
Moisture Sensitivity Level - Transistors
Judgment Criteria of Thermal Evaluation
About Flammability of Materials
Taping Information
Two-Resistor Model for Thermal Simulation
θ<sub>JC</sub> and Ψ<sub>JT</sub>
θ<sub>JA</sub> and Ψ<sub>JT</sub>
About Export Regulations
Anti-Whisker formation - Transistors
MOSFET Gate Resistor Setting for Motor Driving
Method for Monitoring Switching Waveform
Compliance of the RoHS directive
Measurement Method and Usage of Thermal Resistance RthJC
How to Use LTspice® Models
How to Use LTspice® Models: Tips for Improving Convergence
Certificate of not containing SVHC under REACH Regulation