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3212-60037 - AMPHENOL SV MICROWAVE 3212-60037

3212-60037

Active
Amphenol SV Microwave

RF / COAXIAL CONNECTOR, SMPM COAXIAL, STRAIGHT PLUG, THROUGH HOLE VERTICAL, 50 OHM

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3212-60037 - AMPHENOL SV MICROWAVE 3212-60037

3212-60037

Active
Amphenol SV Microwave

RF / COAXIAL CONNECTOR, SMPM COAXIAL, STRAIGHT PLUG, THROUGH HOLE VERTICAL, 50 OHM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification3212-60037
Body FinishGold
Body MaterialStainless Steel
Center Contact MaterialBeryllium Copper
Center Contact PlatingGold
Connector StyleSMPM
Connector TypeMale Pin, Plug
Contact TerminationSolder
Dielectric MaterialPolyamide-Imide (PAI)
FeaturesSmooth Bore, Pre-Tinned (J-STD-001)
Frequency - Max [Max]40 GHz
Housing ColorGold
Impedance50 Ohms
Mating Cycles500
Mounting TypeSurface Mount, Through Hole
Number of Ports1
Operating Temperature [Max]165 °C
Operating Temperature [Min]-65 ░C
Shield TerminationSolder

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 1$ 119.79
10$ 93.46
25$ 85.22

Description

General part information

3212-60 Series

3212-60037 is a threaded male SMPM smooth bore PCB munt connector. Gold over nickel plating is commonly used on Brass, BeCu and stainless steel bodies used in RF PCB Connectors. Its corrosion resistance and electrical connectivity make it an excellent choice for signal transmission and high reliability. However, when these connectors are soldered to PCBs (either by hand or through a reflow process), undesirable remnants of the gold plating can be found in the solder joint. Excess gold in a solder joint can create a gold-tin compound known as AuSn3. These gold striations in the solder joint are brittle - susceptible to breakage under mechanical stress (shock and vibration). Applications include military and aerospace radar transmit/receive units, space and high reliability communications and GPS, harsh environment applications (high vibration, extreme temp), embedded computing, any time de-golding is a concern or requirement.

Documents

Technical documentation and resources