UPD70F3557AM1GMA-GBK-E2-QS-AX

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Renesas Electronics Corporation

IC MCU 32BIT 1.5MB FLSH 176HLQFP

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Renesas Electronics Corporation

IC MCU 32BIT 1.5MB FLSH 176HLQFP

Technical Specifications

Parameters and characteristics for this part

Specification	UPD70F3557AM1GMA-GBK-E2-QS-AX

Connectivity	LINbus, CANbus, UART/USART, CSI, I2C
Core Processor	V850E2
Core Size	32-Bit Single-Core
Data Converters	12 b, 40 x
EEPROM Size	64 K
Mounting Type	Surface Mount
Number of I/O	136
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	176-LQFP Exposed Pad
Peripherals	WDT, PWM, DMA
Program Memory Size	1.5 MB
Program Memory Type	FLASH
RAM Size	112 K
Speed	80 MHz
Supplier Device Package	176-HLQFP (24x24)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	3 V

IC MCU 32BIT 1.5MB FLSH 176HLQFP

Part	RAM Size	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Program Memory Size	Package / Case	Oscillator Type	Speed	EEPROM Size	Core Processor	Connectivity	Supplier Device Package	Number of I/O	Peripherals	Operating Temperature [Max]	Operating Temperature [Min]	Data Converters	Program Memory Type	Mounting Type	Core Size
Renesas Electronics Corporation UPD70F3557AM1GMA-GBK-E2-QS-AX	112 K	5.5 V	3 V	1.5 MB	176-LQFP Exposed Pad	Internal	80 MHz	64 K	V850E2	CANbus, CSI, I2C, LINbus, UART/USART	176-HLQFP (24x24)	136	DMA, PWM, WDT	85 °C	-40 °C	12 b, 40 x	FLASH	Surface Mount	32-Bit Single-Core

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

V850E2 V850E2/Fx4 Microcontroller IC 32-Bit Single-Core 80MHz 1.5MB (1.5M x 8) FLASH 176-HLQFP (24x24)

Technical documentation and resources

No documents available