
PMDPB85UPE,115
ActiveNexperia USA Inc.
20 V DUAL P-CHANNEL TRENCH MOSFET

PMDPB85UPE,115
ActiveNexperia USA Inc.
20 V DUAL P-CHANNEL TRENCH MOSFET
Description
General part information
PMDPB85UPE Series
Dual small-signal P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMDPB85UPE,115 |
|---|---|
| Channel Count | 2 |
| Configuration | P-Channel |
| Configuration - Features | Dual |
| Current - Continuous Drain (Id) | 2.9 A |
| Drain to Source Voltage (Vdss) | 20 V |
| FET Feature | Logic Level Gate |
| Gate Charge (Max) | 8.1 nC |
| Input Capacitance (Ciss) (Max) | 514 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 6-UFDFN Exposed Pad |
| Package Length | 2 mm |
| Package Name | 6-HUSON |
| Package Width | 2 mm |
| Power - Max | 515 mW |
| Rds On (Max) | 103 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs(th) (Max) | 950 mV |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Understanding power MOSFET data sheet parameters
Failure signature of Electrical Overstress on Power MOSFETs
LFPAK MOSFET thermal design guide, Chinese version
RC Thermal Models
Reflow soldering profile
Power MOSFET frequently asked questions and answers
LFPAK MOSFET thermal design guide - Part 2
Power MOSFET single-shot and repetitive avalanche ruggedness rating
Understanding power MOSFET data sheet parameters
DFN2020-6; Reel pack for SMD, 7''; Q2/T3 product orientation
Nexperia package poster
Using power MOSFETs in parallel
plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body
Automatic Optical Inspection of DFN Components
MOSFET load switch PCB with thermal measurement
plastic, leadless thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body
Thermal performance of DFN packages
Questions about package outline drawings