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TO-3PF

R6024ENZC17

Active
Rohm Semiconductor

600V 24A TO-3PF, LOW-NOISE POWER MOSFET

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TO-3PF

R6024ENZC17

Active
Rohm Semiconductor

600V 24A TO-3PF, LOW-NOISE POWER MOSFET

Find alt

Description

General part information

R6024 Series

The R6xxxKNx series are high-speed switching products, Super Junction MOSFETs, that place an emphasis on high efficiency. This series products achieve higher efficiency via high-speed switching. High-speed switching makes it possible to contribute to higher efficiency in PFC and LLC circuits.

Technical Specifications

Parameters and characteristics for this part

SpecificationR6024ENZC17
Current - Continuous Drain (Id) (Tc)24 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Max)70 nC
Input Capacitance (Ciss) (Max)1650 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-3P-3 Full Pack
Package NameTO-3PF
Power Dissipation (Max)120 W
Rds On (Max)165 mOhm, 165 mOhm
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max)4 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Compliance of the RoHS directive
Moisture Sensitivity Level - Transistors
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Impedance Characteristics of Bypass Capacitor
Inner Structure
Constitution Materials List
Basics of Thermal Resistance and Heat Dissipation
Reliability Test Result
Temperature derating method for Safe Operating Area (SOA)
MOSFET Gate Drive Current Setting for Motor Driving
Package Dimensions
How to Use LTspice® Models
Report of SVHC under REACH Regulation
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
How to Create Symbols for PSpice Models
About Export Regulations
List of Transistor Package Thermal Resistance
Judgment Criteria of Thermal Evaluation
Method for Monitoring Switching Waveform
ESD Data
What Is Thermal Design
θ<sub>JA</sub> and Ψ<sub>JT</sub>
R6024ENZ Data Sheet
How to Use the Thermal Resistance and Thermal Characteristics Parameters
What is a Thermal Model? (Transistor)
How to Use LTspice&reg; Models: Tips for Improving Convergence
Precautions When Measuring the Rear of the Package with a Thermocouple
Calculation of Power Dissipation in Switching Circuit
Two-Resistor Model for Thermal Simulation
Types and Features of Transistors
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Part Explanation
About Flammability of Materials
Notes for Calculating Power Consumption:Static Operation
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Notes for Temperature Measurement Using Thermocouples
Importance of Probe Calibration When Measuring Power: Deskew
MOSFET Gate Resistor Setting for Motor Driving
Measurement Method and Usage of Thermal Resistance RthJC
Anti-Whisker formation - Transistors
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
PCB Layout Thermal Design Guide