Specification	SIP41430-001LF

Contact Finish - Mating	Tin
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	200 Ąin
Contact Finish Thickness - Post	200 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Features	Closed Frame
Grid Columns	2
Grid Rows	1
Housing Material	Nylon, Polyamide, PA
Mounting Type	Surface Mount
Number of Positions or Pins (Grid)	2
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Type	SIP

SIP4143 Series

Part	Contact Material - Mating	Pitch - Post	Contact Finish Thickness - Post	Type	Features	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)	Termination	Pitch - Mating	Mounting Type	Housing Material	Contact Material - Post	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish - Mating
Amphenol ICC (FCI) SIP41430-001LF	Beryllium Copper	0.1 in	200 µin	SIP	Closed Frame	2	1	2	Solder	0.1 in	Surface Mount	Nylon PA Polyamide	Beryllium Copper	Tin	200 Ąin	Tin

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