W66BL6NBUAHJ

Active

Winbond Electronics

IC DRAM 2GBIT LVSTL 11 200WFBGA

Search across all available documentation for this part.

Active

Winbond Electronics

IC DRAM 2GBIT LVSTL 11 200WFBGA

Technical Specifications

Parameters and characteristics commom to parts in this series

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	144	$ 6.78

IC DRAM 2GBIT LVSTL 11 200WFBGA

Part	Memory Size	Memory Format	Write Cycle Time - Word, Page	Memory Organization	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Type	Supplier Device Package	Technology	Clock Frequency	Package / Case	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type
Winbond Electronics W66BL6NBUAHJ TR	2 Gbit	DRAM	18 ns	128 M	1.06 V, 1.7 V	1.17 V, 1.95 V	Volatile	200-WFBGA (10x14.5)	SDRAM - Mobile LPDDR4	2.133 GHz	200-WFBGA	105 °C	-40 °C	Surface Mount
Winbond Electronics W66BL6NBUAFJ TR	2 Gbit	DRAM	18 ns	128 M	1.06 V, 1.7 V	1.17 V, 1.95 V	Volatile	200-WFBGA (10x14.5)	SDRAM - Mobile LPDDR4	1.6 GHz	200-WFBGA	105 °C	-40 °C	Surface Mount
Winbond Electronics W66BL6NBUAGJ TR	2 Gbit	DRAM	18 ns	128 M	1.06 V, 1.7 V	1.17 V, 1.95 V	Volatile	200-WFBGA (10x14.5)	SDRAM - Mobile LPDDR4	1866 MHz	200-WFBGA	105 °C	-40 °C	Surface Mount
Winbond Electronics W66BL6NBUAHJ	2 Gbit	DRAM	18 ns	128 M	1.06 V, 1.7 V	1.17 V, 1.95 V	Volatile	200-WFBGA (10x14.5)	SDRAM - Mobile LPDDR4	2.133 GHz	200-WFBGA	105 °C	-40 °C	Surface Mount

General part information

SDRAM - Mobile LPDDR4 Memory IC 2Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)

Technical documentation and resources