RB228T-60HZC9
ActiveRohm Semiconductor
SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)
RB228T-60HZC9
ActiveRohm Semiconductor
SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)
Description
General part information
RB228T-60HZ Series
RB228T-60HZ is super low IRand high reliability Automotive schottky barrier diode for switching power supply.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB228T-60HZC9 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 15 A |
| Current - Reverse Leakage | 10 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Grade | Automotive |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FN |
| Qualification | AEC-Q101 |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 60 V |
| Voltage - Forward (Vf) (Max) | 830 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Importance of Probe Calibration When Measuring Power: Deskew
Moisture Sensitivity Level - Diodes
About Flammability of Materials
Measurement Method and Usage of Thermal Resistance RthJC
Absolute Maximum Rating and Electrical Characteristics of Diodes
Judgment Criteria of Thermal Evaluation
List of Diode Package Thermal Resistance
Taping Information
What is a Thermal Model? (Diode)
Constitution Materials List
About Export Regulations
PCB Layout Thermal Design Guide
Diode Selection Method for Asynchronous Converter
Two-Resistor Model for Thermal Simulation
Certificate of not containing SVHC under REACH Regulation
Compliance of the RoHS directive
Package Dimensions
How to Use LTspice® Models
How to Select Reverse Current Protection Diodes for LDO Regulators
Notes for Temperature Measurement Using Thermocouples
Inner Structure
Notes for Calculating Power Consumption:Static Operation
Condition of Soldering / Land Pattern Reference
How to Use LTspice® Models: Tips for Improving Convergence
Explanation for Marking
Power Loss and Thermal Design of Diodes
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Anti-Whisker formation - Diodes
Basics of Thermal Resistance and Heat Dissipation
Precautions When Measuring the Rear of the Package with a Thermocouple
RB228T-60HZ ESD Data
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Method for Monitoring Switching Waveform
Diode Types and Applications
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Impedance Characteristics of Bypass Capacitor
How to Select Rectifier Diodes
Reliability Test Result
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Notes for Temperature Measurement Using Forward Voltage of PN Junction
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Part Explanation
What Is Thermal Design
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)