MSP430FR59691IRGZT

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Texas Instruments

16 MHZ MCU WITH 64KB FRAM, 2KB SRAM, AES, 12-BIT ADC, COMPARATOR, DMA, UART/SPI/I2C, TIMER

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Search across all available documentation for this part.

DocumentsMSP430FR58,59,68,69xx User Guide MSP430 FRAM Quality and Reliability (Rev. A)+31

MSP430FR59691IRGZT

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Texas Instruments

16 MHZ MCU WITH 64KB FRAM, 2KB SRAM, AES, 12-BIT ADC, COMPARATOR, DMA, UART/SPI/I2C, TIMER

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DocumentsMSP430FR58,59,68,69xx User Guide MSP430 FRAM Quality and Reliability (Rev. A)+31

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	MSP430FR59691IRGZT	MSP430FR59691 Series

Connectivity	IrDA, UART/USART, SCI, SPI, I2C	IrDA, UART/USART, SCI, SPI, I2C
Core Processor	MSP430 CPUXV2	MSP430 CPUXV2
Core Size	16-Bit	16-Bit
Data Converters [custom]	16	16
Data Converters [custom]	12 b	12 b
Mounting Type	Surface Mount	Surface Mount
Number of I/O	40	40
Operating Temperature [Max]	85 °C	85 °C
Operating Temperature [Min]	-40 °C	-40 °C
Oscillator Type	Internal	Internal
Package / Case	48-VFQFN Exposed Pad	48-VFQFN Exposed Pad
Peripherals	Brown-out Detect/Reset, DMA, POR, WDT, PWM	Brown-out Detect/Reset, DMA, POR, WDT, PWM
Program Memory Size	64 KB	64 KB
Program Memory Type	FRAM	FRAM
RAM Size	2K x 8	2K x 8
Speed	16 MHz	16 MHz
Supplier Device Package	48-VQFN (7x7)	48-VQFN (7x7)
Voltage - Supply (Vcc/Vdd) [Max]	3.6 V	3.6 V
Voltage - Supply (Vcc/Vdd) [Min]	1.8 V	1.8 V

MSP430FR59691 Series

16 MHz MCU with 64KB FRAM, 2KB SRAM, AES, 12-bit ADC, comparator, DMA, UART/SPI/I2C, timer

Part	Supplier Device Package	Oscillator Type	Program Memory Type	RAM Size	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Core Size	Data Converters [custom]	Data Converters [custom]	Speed	Connectivity	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Core Processor	Peripherals	Package / Case	Number of I/O	Program Memory Size
Texas Instruments MSP430FR59691IRGZR	48-VQFN (7x7)	Internal	FRAM	2K x 8	1.8 V	3.6 V	16-Bit	16	12 b	16 MHz	I2C, IrDA, SCI, SPI, UART/USART	85 °C	-40 °C	Surface Mount	MSP430 CPUXV2	Brown-out Detect/Reset, DMA, POR, PWM, WDT	48-VFQFN Exposed Pad	40	64 KB
Texas Instruments MSP430FR59691IRGZT	48-VQFN (7x7)	Internal	FRAM	2K x 8	1.8 V	3.6 V	16-Bit	16	12 b	16 MHz	I2C, IrDA, SCI, SPI, UART/USART	85 °C	-40 °C	Surface Mount	MSP430 CPUXV2	Brown-out Detect/Reset, DMA, POR, PWM, WDT	48-VFQFN Exposed Pad	40	64 KB

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 6.23
		10	$ 5.63
		25	$ 5.37
		100	$ 4.66
	Digi-Reel®	1	$ 6.23
		10	$ 5.63
		25	$ 5.37
		100	$ 4.66
	Tape & Reel (TR)	250	$ 4.45
		500	$ 4.06
		1250	$ 3.53
		2500	$ 3.40
LCSC	Piece	1	$ 8.55
		250	$ 3.31
		500	$ 3.19
		1000	$ 3.14
Texas Instruments	SMALL T&R	1	$ 4.77
		100	$ 3.89
		250	$ 3.06
		1000	$ 2.59

Description

General part information

MSP430FR59691 Series

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

The MSP430 ULP FRAM portfolio consists of a diverse set of devices featuring FRAM, the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP architecture showcases seven low-power modes, optimized to achieve extended battery life in energy-challenged applications.

Documents

Technical documentation and resources

MSP430FR59691IRGZT

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MSP430FR59691IRGZT

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Technical Specifications

MSP430FR59691 Series

Pricing

Description

MSP430FR59691 Series

Documents

MSP430FR58,59,68,69xx User Guide

MSP430 FRAM Quality and Reliability (Rev. A)

Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B)

Benchmarking MCU power consumption for ultra-low-power applications

Crypto-Bootloader (CryptoBSL) for MSP430FR59xx and MSP430FR69xx MCUs

MSP430 FRAM Devices Bootloader (BSL) User's Guide (Rev. AB)

MSP-EXP430FR5969 Quick Start Guide (Rev. A)

Random Number Generation Using MSP430FR59xx and MSP430FR69xx Microcontrollers

System advantages of mixed signal integration

MSP430 Firmware Updates over I2C using Linux

Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)

Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)

MSP430 System-Level ESD Considerations (Rev. B)

Secure In-Field Firmware Updates for MSP MCUs

MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P)

MSP430 MCUs Development Guide Book (Rev. A)

ESD Diode Current Specification (Rev. B)

Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)

Capacitive Touch and MSP Microcontrollers (Rev. A)

MSP430FR596x, MSP430FR594x Mixed-Signal Microcontrollers datasheet (Rev. G)

Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers

FRAM FAQs

MSP430 FRAM Technology – How To and Best Practices (Rev. B)

MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology

MSP430FR5969 LaunchPad Development Kit (MSP-EXP430FR5969) User's Guide (Rev. B)

General Oversampling of MSP ADCs for Higher Resolution (Rev. A)

MSP430 System ESD Troubleshooting Guide

Getting Started With EEMBC ULPBench on MSP-EXP430FR5969 (Rev. A)

Enabling secure portable medical devices with TI’s MSP430™ MCU

Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)

Migrating From MSP430F4xx Family to MSP430FR58xx/FR59xx/FR68xx/FR69xx Family (Rev. B)

MSP430FR59691 Microcontroller Errata (Rev. Z)

MSP Code Protection Features

Technical Specifications

MSP430FR59691 Series