SSW-136-03-G-D-RA
ActiveSamtec Inc.
CONN RCPT 72POS 0.1 GOLD PCB R/A
Deep-Dive with AI
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SSW-136-03-G-D-RA
ActiveSamtec Inc.
CONN RCPT 72POS 0.1 GOLD PCB R/A
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SSW-136-03-G-D-RA |
|---|---|
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.51 µm |
| Contact Finish Thickness - Mating | 20 µin |
| Contact Finish Thickness - Post | 3 µin |
| Contact Finish Thickness - Post | 0.076 µm |
| Contact Length - Post [x] | 7.62 mm |
| Contact Length - Post [x] | 0.3 " |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Current Rating (Amps) | 4.7 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.195 in |
| Insulation Height | 4.95 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole, Right Angle |
| Number of Positions | 72 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Row Spacing - Mating [x] | 2.54 mm |
| Row Spacing - Mating [x] | 0.1 in |
| Style | Board to Board, Cable |
| Termination | Solder |
SSW-136 Series
| Part | Contact Length - Post [x] | Contact Length - Post [x] | Connector Type | Termination | Mounting Type | Insulation Color | Contact Type | Number of Rows | Operating Temperature [Min] | Operating Temperature [Max] | Contact Shape | Insulation Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Style | Fastening Type | Insulation Height | Insulation Height | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Material | Material Flammability Rating | Contact Finish - Post | Number of Positions | Number of Positions Loaded | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Length - Post | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 7.62 mm | 0.3 " | Receptacle | Solder | Through Hole Right Angle | Black | Forked | 2 | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm | 4.7 A | Board to Board Cable | Push-Pull | 0.195 in | 4.95 mm | Gold | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Phosphor Bronze | UL94 V-0 | Gold | 72 | All | 0.51 µm | 20 µin | ||
Samtec Inc. | Receptacle | Solder | Through Hole | Black | Forked | 3 | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm | 4.7 A | Board to Board Cable | Push-Pull | 0.335 " | 8.51 mm | Gold | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Phosphor Bronze | UL94 V-0 | Gold | 108 | All | 0.51 µm | 20 µin | 4.93 mm | 0.194 in | ||
Samtec Inc. | 14.83 mm | 0.584 " | Receptacle | Solder | Through Hole | Black | Forked | 1 | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm | 4.7 A | Board to Board Cable | Push-Pull | 0.335 " | 8.51 mm | Gold | 0.1 in | 2.54 mm | Phosphor Bronze | UL94 V-0 | Gold | 36 | All | 0.51 µm | 20 µin | ||||
Samtec Inc. | Receptacle | Solder | Through Hole | Black | Forked | 1 | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | 4.7 A | Board to Board Cable | Push-Pull | 0.335 " | 8.51 mm | Gold | 0.1 in | 2.54 mm | Phosphor Bronze | UL94 V-0 | Tin | 36 | All | 0.076 µm | 3 µin | 2.64 mm | 0.104 in | ||||||
Samtec Inc. | Receptacle | Solder | Through Hole | Black | Forked | 3 | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | 4.7 A | Board to Board Cable | Push-Pull | 0.335 " | 8.51 mm | Gold | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Phosphor Bronze | UL94 V-0 | Tin | 108 | All | 0.76 Ám | 30 Áin | 2.64 mm | 0.104 in | ||||
Samtec Inc. | Receptacle | Solder | Through Hole | Black | Forked | 2 | -55 °C | 105 ░C | Square | Liquid Crystal Polymer (LCP) | 4.7 A | Board to Board Cable | Push-Pull | 0.335 " | 8.51 mm | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Phosphor Bronze | UL94 V-0 | Tin | 72 | All | 10 mm | 0.394 in | |||||||
Samtec Inc. | Receptacle | Solder | Through Hole Right Angle | Black | Forked | 2 | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm | 4.7 A | Board to Board Cable | Push-Pull | 0.195 in | 4.95 mm | Gold | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Phosphor Bronze | UL94 V-0 | Gold | 72 | All | 0.51 µm | 20 µin | 2.54 mm | 0.1 in | ||
Samtec Inc. | Receptacle | Solder | Through Hole | Black | Forked | 1 | -55 °C | 105 ░C | Square | Liquid Crystal Polymer (LCP) | 4.7 A | Board to Board Cable | Push-Pull | 0.335 " | 8.51 mm | 0.1 in | 2.54 mm | Phosphor Bronze | UL94 V-0 | Tin | 36 | All | 3.15 mm | 0.124 " | |||||||||
Samtec Inc. | Receptacle | Solder | Through Hole | Black | Forked | 1 | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | 4.7 A | Board to Board Cable | Push-Pull | 0.335 " | 8.51 mm | Gold | 0.1 in | 2.54 mm | Phosphor Bronze | UL94 V-0 | Tin | 36 | All | 0.76 Ám | 30 Áin | 4.93 mm | 0.194 in | ||||||
Samtec Inc. | Receptacle | Solder | Through Hole | Black | Forked | 2 | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | 4.7 A | Board to Board Cable | Push-Pull | 0.335 " | 8.51 mm | Gold | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | Phosphor Bronze | UL94 V-0 | Tin | 72 | All | 0.076 µm | 3 µin | 2.64 mm | 0.104 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 1 | $ 11.61 | |
| 6 | $ 11.61 | |||
Description
General part information
SSW-136 Series
72 Position Receptacle Connector 0.100" (2.54mm) Through Hole, Right Angle Gold
Documents
Technical documentation and resources
No documents available