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100-018-050

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3M

CONN IC DIP SOCKET 18POS GOLD

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100-018-050

Active
3M

CONN IC DIP SOCKET 18POS GOLD

Deep-Dive with AI

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification100-018-050100-018 Series
Contact Finish - MatingGoldGold
Contact Finish - PostGoldGold
Contact Finish Thickness - Mating0.203 Ám0.203 Ám
Contact Finish Thickness - Mating8 Áin8 Áin
Contact Finish Thickness - PostFlashFlash
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - Post [custom]BrassBrass
Current Rating (Amps)1 A1 A
FeaturesOpen FrameOpen Frame, Seal Tape, Closed Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass FilledPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleThrough Hole
Number of Positions or Pins (Grid)1818
Operating Temperature [Max]125 °C125 °C
Operating Temperature [Min]-65 ░C-65 ░C
Pitch - Mating0.1 in0.1 in
Pitch - Mating2.54 mm2.54 mm
Pitch - Post2.54 mm2.54 mm
Pitch - Post0.1 in0.1 in
TerminationSolderSolder
Termination Post Length3.2 mm3.2 mm
Termination Post Length0.126 in0.126 in
Type0.3 "0.3 "
Type7.62 mm7.62 mm
TypeDIPDIP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

100-018 Series

CONN IC DIP SOCKET 18POS GOLD

PartOperating Temperature [Max]Operating Temperature [Min]Contact Material - Post [custom]FeaturesContact Material - MatingContact Finish Thickness - PostContact Finish Thickness - MatingContact Finish Thickness - MatingMaterial Flammability RatingTermination Post LengthTermination Post LengthHousing MaterialPitch - PostPitch - PostContact Finish - PostCurrent Rating (Amps)Number of Positions or Pins (Grid)Mounting TypePitch - MatingPitch - MatingContact Finish - MatingTerminationTypeTypeType
125 °C
-65 ░C
Brass
Open Frame
Beryllium Copper
Flash
0.203 Ám
8 Áin
UL94 V-0
3.2 mm
0.126 in
Polyphenylene Sulfide (PPS), Glass Filled
2.54 mm
0.1 in
Gold
1 A
18
Through Hole
0.1 in
2.54 mm
Gold
Solder
0.3 "
7.62 mm
DIP
125 °C
-65 ░C
Brass
Closed Frame, Seal Tape
Beryllium Copper
Flash
0.203 Ám
8 Áin
UL94 V-0
3.2 mm
0.126 in
Polyphenylene Sulfide (PPS), Glass Filled
2.54 mm
0.1 in
Gold
1 A
18
Through Hole
0.1 in
2.54 mm
Gold
Solder
0.3 "
7.62 mm
DIP

Description

General part information

100-018 Series

18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available