STM32F412RET7

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STM32 DYNAMIC EFFICIENCY MCU WITH BAM, HIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M4 MCU WITH 512 KBYTES OF FLASH MEMORY, 100 MHZ CPU, ART ACCELERATOR, DFSDM

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STM32F412RET7

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STMicroelectronics

STM32 DYNAMIC EFFICIENCY MCU WITH BAM, HIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M4 MCU WITH 512 KBYTES OF FLASH MEMORY, 100 MHZ CPU, ART ACCELERATOR, DFSDM

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Description Specifications Series Pricing CAD Documents

Description

General part information

STM32F412RE Series

STM32F412xE/G devices are based on the high-performance Arm®Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

STM32F412xE/G devices belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.

STM32F412xE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.

Technical Specifications

Parameters and characteristics for this part

Specification	STM32F412RET7

A/D Channels	16 count
A/D Resolution (bits)	12 bit
Connectivity	LINbus, MMC, I2C, IrDA, SD, UART, USB, QSPI, USB OTG, EBI, SDIO, USART, SPI, EMI, CANbus
Core Processor	ARM® Cortex®-M4
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	50
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package / Case	64-LQFP
Package Length	10 mm
Package Name	64-LQFP
Package Width	10 mm
Peripherals	WDT, POR, LCD, Reset, I2S, Brown-out Detect, PWM, DMA
Program Memory Depth	512 K
Program Memory Size	512 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	256 K
RAM Size Width	8 bit
Speed	100 MHz
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	1.7 V

STM32F412RE Series

Part	Peripherals	Core Processor	Connectivity	Oscillator Type	Core Size (Bit Width)	Speed	Package / Case	A/D Resolution (bits)	A/D Channels	RAM Size Depth	RAM Size Width	Package Width	Package Name	Package Length	Operating Temperature (Max)	Operating Temperature (Min)	Program Memory Size	Program Memory Width	Program Memory Depth	Number of I/O	Mounting Type	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Program Memory Type
STMicroelectronics STM32F412VGT6TR	Brown-out Detect DMA I2S LCD POR PWM Reset WDT	ARM® Cortex®-M4	CANbus EBI EMI I2C IrDA LINbus MMC QSPI SD SDIO SPI UART USART USB OTG	Internal	32 Bit	100 MHz	100-LQFP	12 bit	16 count	256 K	8 bit	14 mm	100-LQFP	14 mm	85 °C	-40 °C	1 MB	8 bit	1 M	81	Surface Mount	1.7 V	3.6 V	FLASH
STMicroelectronics STM32F412VGT6	Brown-out Detect DMA I2S LCD POR PWM Reset WDT	ARM® Cortex®-M4	CANbus EBI EMI I2C IrDA LINbus MMC QSPI SD SDIO SPI UART USART USB OTG	Internal	32 Bit	100 MHz	100-LQFP	12 bit	16 count	256 K	8 bit	14 mm	100-LQFP	14 mm	85 °C	-40 °C	1 MB	8 bit	1 M	81	Surface Mount	1.7 V	3.6 V	FLASH
STMicroelectronics STM32F412VGH6	Brown-out Detect DMA I2S LCD POR PWM Reset WDT	ARM® Cortex®-M4	CANbus EBI EMI I2C IrDA LINbus MMC QSPI SD SDIO SPI UART USART USB OTG	Internal	32 Bit	100 MHz	100-UFBGA	12 bit	16 count	256 K	8 bit	7 mm	100-UFBGA	7 mm	85 °C	-40 °C	1 MB	8 bit	1 M	81	Surface Mount	1.7 V	3.6 V	FLASH

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

STM32F412RET7 | Datasheet