HMTSW-101-07-G-D-240

Active

Samtec Inc.

CONN HEADER VERT 2POS

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

HMTSW-101-07-G-D-240

Active

Samtec Inc.

CONN HEADER VERT 2POS

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	HMTSW-101-07-G-D-240

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Mating	6.1 mm
Contact Length - Mating [x]	0.24 in
Contact Length - Post	0.09 "
Contact Length - Post	2.29 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3 A
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	0.1 in
Insulation Height	2.54 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	2
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Overall Contact Length	0.43 in
Overall Contact Length	10.92 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

HMTSW-101 Series

Part	Contact Finish - Post	Shrouding	Overall Contact Length	Overall Contact Length	Connector Type	Contact Length - Post [x]	Contact Length - Post [x]	Number of Positions Loaded	Contact Length - Mating [x]	Contact Length - Mating [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Material Flammability Rating	Number of Positions	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Insulation Height	Insulation Height	Contact Shape	Operating Temperature [Min]	Operating Temperature [Max]	Number of Rows	Insulation Material	Contact Type	Mounting Type	Style	Contact Material	Fastening Type	Termination	Insulation Color	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Length - Mating	Contact Length - Mating	Contact Length - Post	Contact Length - Post	Overall Contact Length [x]	Overall Contact Length [x]	Contact Length - Mating [custom]	Contact Length - Mating [custom]
Samtec Inc. HMTSW-101-24-G-S-245	Gold	Unshrouded	0.48 in	12.19 mm	Header	0.135 in	3.43 mm	All	6.22 mm	0.245 in	3 µin	0.076 µm	3 A	UL94 V-0	1	10 çin	0.25 çm	Gold	0.1 in	2.54 mm	Square	-55 °C	125 °C	1	Liquid Crystal Polymer (LCP)	Male Pin	Through Hole	Board to Board Cable	Phosphor Bronze	Push-Pull	Solder	Natural
Samtec Inc. HMTSW-101-10-G-D-640	Gold	Unshrouded	0.83 in	21.08 mm	Header			All			3 µin	0.076 µm	3 A	UL94 V-0	2	10 çin	0.25 çm	Gold	0.1 in	2.54 mm	Square	-55 °C	125 °C	2	Liquid Crystal Polymer (LCP)	Male Pin	Through Hole	Board to Board Cable	Phosphor Bronze	Push-Pull	Solder	Natural	2.54 mm	0.1 in	16.26 mm	0.64 in	0.09 "	2.29 mm
Samtec Inc. HMTSW-101-22-T-S-300	Tin	Unshrouded			Header			All					3 A	UL94 V-0	1				0.1 in	2.54 mm	Square	-55 °C	105 ░C	1	Liquid Crystal Polymer (LCP)	Male Pin	Through Hole	Board to Board Cable	Phosphor Bronze	Push-Pull	Solder	Natural			7.62 mm	0.3 in	0.23 in	5.84 mm	0.63 "	16 mm
Samtec Inc. HMTSW-101-23-SM-D-225	Tin	Unshrouded	0.445 "	11.3 mm	Header	0.12 in	3.05 mm	All					3 A	UL94 V-0	2	30 Áin	0.76 Ám	Gold	0.1 in	2.54 mm	Square	-55 °C	125 °C	2	Liquid Crystal Polymer (LCP)	Male Pin	Through Hole	Board to Board Cable	Phosphor Bronze	Push-Pull	Solder	Natural	2.54 mm	0.1 in	5.72 mm	0.225 in
Samtec Inc. HMTSW-101-09-T-S-520	Tin	Unshrouded	0.73 in	18.54 mm	Header	0.11 in		All	13.21 mm	0.52 in			3 A	UL94 V-0	1				0.1 in	2.54 mm	Square	-55 °C	105 ░C	1	Liquid Crystal Polymer (LCP)	Male Pin	Through Hole	Board to Board Cable	Phosphor Bronze	Push-Pull	Solder	Natural						2.79 mm
Samtec Inc. HMTSW-101-24-T-S-275	Tin	Unshrouded	0.48 in	12.19 mm	Header			All					3 A	UL94 V-0	1				0.1 in	2.54 mm	Square	-55 °C	105 ░C	1	Liquid Crystal Polymer (LCP)	Male Pin	Through Hole	Board to Board Cable	Phosphor Bronze	Push-Pull	Solder	Natural					0.105 in	2.67 mm			0.275 in	6.99 mm
Samtec Inc. HMTSW-101-24-SM-S-230	Tin	Unshrouded	0.48 in	12.19 mm	Header	0.15 in	3.81 mm	All		0.23 in			3 A	UL94 V-0	1	30 Áin	0.76 Ám	Gold	0.1 in	2.54 mm	Square	-55 °C	125 °C	1	Liquid Crystal Polymer (LCP)	Male Pin	Through Hole	Board to Board Cable	Phosphor Bronze	Push-Pull	Solder	Natural			5.84 mm
Samtec Inc. HMTSW-101-10-T-S-530-RA	Tin	Unshrouded			Header			All					3 A	UL94 V-0	1				0.122 in	3.1 mm	Square	-55 °C	105 ░C	1	Liquid Crystal Polymer (LCP)	Male Pin	Through Hole Right Angle	Board to Board Cable	Phosphor Bronze	Push-Pull	Solder	Natural			13.46 mm						0.53 in
Samtec Inc. HMTSW-101-06-G-S-200	Gold	Unshrouded	0.3 in	7.62 mm	Header			All	5.08 mm	0.2 in	3 µin	0.076 µm	3 A	UL94 V-0	1	10 çin	0.25 çm	Gold	0.1 in	2.54 mm	Square	-55 °C	125 °C	1	Liquid Crystal Polymer (LCP)	Male Pin	Through Hole	Board to Board Cable	Phosphor Bronze	Push-Pull	Solder	Natural
Samtec Inc. HMTSW-101-07-G-D-240	Gold	Unshrouded	0.43 in	10.92 mm	Header			All		0.24 in	3 µin	0.076 µm	3 A	UL94 V-0	2	10 çin	0.25 çm	Gold	0.1 in	2.54 mm	Square	-55 °C	125 °C	2	Liquid Crystal Polymer (LCP)	Male Pin	Through Hole	Board to Board Cable	Phosphor Bronze	Push-Pull	Solder	Natural	2.54 mm	0.1 in	6.1 mm		0.09 "	2.29 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 0.55

Description

General part information

HMTSW-101 Series

Connector Header Through Hole 2 position

Documents

Technical documentation and resources