SP8K33HZGTB
ActiveRohm Semiconductor
MOSFET, N-CH, 60V, 5A, SOP ROHS COMPLIANT: YES
SP8K33HZGTB
ActiveRohm Semiconductor
MOSFET, N-CH, 60V, 5A, SOP ROHS COMPLIANT: YES
Description
General part information
SP8K33 Series
SP8K33HZG is an automotive grade MOSFET that is AEC-Q101 qualified. Two Nch 60V MOSFETs are included in the SOP8 package. Built-in ESD protection diode. Ideal for switching applications.
Technical Specifications
Parameters and characteristics for this part
| Specification | SP8K33HZGTB |
|---|---|
| Channel Count | 2 |
| Configuration | N-Channel |
| Configuration - Features | Dual |
| Current - Continuous Drain (Id) (Ta) | 5 A |
| Drain to Source Voltage (Vdss) | 60 V |
| Gate Charge (Max) | 12 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 620 pF |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package Length | 0.154 in |
| Package Name | 8-SOP, 8-SOIC |
| Package Width | 3.9 mm |
| Power - Max (Ta) | 2 W |
| Qualification | AEC-Q101 |
| Rds On (Max) | 48 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs(th) (Max) | 2.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Technical Data Sheet EN
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
MOSFET Gate Resistor Setting for Motor Driving
What Is Thermal Design
Two-Resistor Model for Thermal Simulation
Condition of Soldering / Land Pattern Reference
Method for Monitoring Switching Waveform
Notes for Temperature Measurement Using Thermocouples
Basics of Thermal Resistance and Heat Dissipation
Taping Information
How to Use the Thermal Resistance and Thermal Characteristics Parameters
How to Use LTspice® Models: Tips for Improving Convergence
Types and Features of Transistors
Compliance of the RoHS directive
Part Explanation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Certificate of not containing SVHC under REACH Regulation
Impedance Characteristics of Bypass Capacitor
About Export Regulations
Calculation of Power Dissipation in Switching Circuit
Importance of Probe Calibration When Measuring Power: Deskew
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Precautions When Measuring the Rear of the Package with a Thermocouple
Notes for Calculating Power Consumption:Static Operation
About Flammability of Materials
Temperature derating method for Safe Operating Area (SOA)
Judgment Criteria of Thermal Evaluation
PCB Layout Thermal Design Guide
θ<sub>JA</sub> and Ψ<sub>JT</sub>
SP8K33HZG ESD Data
List of Transistor Package Thermal Resistance
How to Use LTspice® Models
What is a Thermal Model? (Transistor)
Measurement Method and Usage of Thermal Resistance RthJC
Anti-Whisker formation - Transistors
Explanation for Marking
MOSFET Gate Drive Current Setting for Motor Driving
Reliability Test Result
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Package Dimensions
Moisture Sensitivity Level - Transistors
