8080-1G45

Obsolete

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

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8080-1G45

Obsolete

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

8080 Series

3 (Oval) Pos Transistor, TO-3 Socket Tin Chassis Mount

Documents

Technical documentation and resources

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	8080-1G45	8080 Series

Contact Finish - Mating	-	Tin-Lead, Gold, Silver
Contact Finish - Post	Tin	Tin-Lead, Gold, Silver, Tin
Contact Finish Thickness - Mating	-	0.51 - 12.7 µm
Contact Finish Thickness - Mating	-	20 - 500 µin
Contact Finish Thickness - Post	-	0.51 - 12.7 µm
Contact Finish Thickness - Post	-	20 - 500 µin
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	-	25 mOhm
Features	Closed Frame	Closed Frame
Housing Material	Polytetrafluoroethylene (PTFE)	Phenolic, Polytetrafluoroethylene (PTFE), Diallyl Phthalate, Fluoropolymer (FP)
Material Flammability Rating	-	UL94 V-0
Mounting Type	Chassis Mount	Through Hole, Chassis Mount
Number of Positions or Pins (Grid)	3	3 - 4
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Termination	Solder	Solder
Type	Transistor, TO-3	Transistor, TO-3

8080 Series

CONN SOCKET TRANSIST TO-3 3POS

Part	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]	Type	Features	Housing Material	Contact Material - Mating	Contact Finish - Post	Material Flammability Rating	Contact Material - Post	Termination	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Resistance
TE Connectivity AMP Connectors 8080-1G14	Through Hole	5.08 µm	200 µin	3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Phenolic	Beryllium Copper	Tin-Lead	UL94 V-0	Beryllium Copper	Solder	Tin-Lead
TE Connectivity AMP Connectors 8080-1G25	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Gold		Beryllium Copper	Solder	Gold
TE Connectivity AMP Connectors 8080-1G13	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Tin-Lead		Beryllium Copper	Solder	Tin-Lead
TE Connectivity AMP Connectors 8080-1G37	Chassis Mount	12.7 µm	500 µin	3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Diallyl Phthalate	Beryllium Copper	Silver	UL94 V-0	Beryllium Copper	Solder	Silver	12.7 µm	500 µin
TE Connectivity AMP Connectors 8080-1G31	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Tin		Beryllium Copper	Solder
TE Connectivity AMP Connectors 8080-1G24	Chassis Mount	0.51 µm	20 µin	3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Diallyl Phthalate	Beryllium Copper	Tin-Lead	UL94 V-0	Beryllium Copper	Solder	Tin-Lead	0.51 µm	20 µin	25 mOhm
TE Connectivity AMP Connectors 8080-1G17	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Tin		Beryllium Copper	Solder
TE Connectivity AMP Connectors 8080-1G35	Chassis Mount	5.08 µm	200 µin	3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Diallyl Phthalate	Beryllium Copper	Tin-Lead	UL94 V-0	Beryllium Copper	Solder	Tin-Lead	0.51 µm	20 µin	25 mOhm
TE Connectivity AMP Connectors 8080-1G39	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Gold		Beryllium Copper	Solder	Gold
TE Connectivity AMP Connectors 8080-1G45	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Tin		Beryllium Copper	Solder