CONN SOCKET TRANSIST TO-3 3POS
| Part | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Operating Temperature [Min] | Operating Temperature [Max] | Type | Features | Housing Material | Contact Material - Mating | Contact Finish - Post | Material Flammability Rating | Contact Material - Post | Termination | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors 8080-1G14 | Through Hole | 5.08 µm | 200 µin | 3 | -55 °C | 125 °C | Transistor, TO-3 | Closed Frame | Phenolic | Beryllium Copper | Tin-Lead | UL94 V-0 | Beryllium Copper | Solder | Tin-Lead | |||
TE Connectivity AMP Connectors 8080-1G25 | Chassis Mount | 3 | -55 °C | 125 °C | Transistor, TO-3 | Closed Frame | Polytetrafluoroethylene (PTFE) | Beryllium Copper | Gold | Beryllium Copper | Solder | Gold | ||||||
TE Connectivity AMP Connectors 8080-1G13 | Chassis Mount | 3 | -55 °C | 125 °C | Transistor, TO-3 | Closed Frame | Polytetrafluoroethylene (PTFE) | Beryllium Copper | Tin-Lead | Beryllium Copper | Solder | Tin-Lead | ||||||
TE Connectivity AMP Connectors 8080-1G37 | Chassis Mount | 12.7 µm | 500 µin | 3 | -55 °C | 125 °C | Transistor, TO-3 | Closed Frame | Diallyl Phthalate | Beryllium Copper | Silver | UL94 V-0 | Beryllium Copper | Solder | Silver | 12.7 µm | 500 µin | |
TE Connectivity AMP Connectors 8080-1G16-LF | Chassis Mount | 3 | -55 °C | 125 °C | Transistor, TO-3 | Closed Frame | Polytetrafluoroethylene (PTFE) | Beryllium Copper | Silver | Beryllium Copper | Solder | Silver | ||||||
TE Connectivity AMP Connectors 8080-1G24 | Chassis Mount | 0.51 µm | 20 µin | 3 | -55 °C | 125 °C | Transistor, TO-3 | Closed Frame | Diallyl Phthalate | Beryllium Copper | Tin-Lead | UL94 V-0 | Beryllium Copper | Solder | Tin-Lead | 0.51 µm | 20 µin | 25 mOhm |
TE Connectivity AMP Connectors 8080-1G17 | Chassis Mount | 3 | -55 °C | 125 °C | Transistor, TO-3 | Closed Frame | Polytetrafluoroethylene (PTFE) | Beryllium Copper | Tin | Beryllium Copper | Solder | |||||||
TE Connectivity AMP Connectors 8080-1G35 | Chassis Mount | 5.08 µm | 200 µin | 3 | -55 °C | 125 °C | Transistor, TO-3 | Closed Frame | Diallyl Phthalate | Beryllium Copper | Tin-Lead | UL94 V-0 | Beryllium Copper | Solder | Tin-Lead | 0.51 µm | 20 µin | 25 mOhm |
TE Connectivity AMP Connectors 8080-1G39 | Chassis Mount | 3 | -55 °C | 125 °C | Transistor, TO-3 | Closed Frame | Polytetrafluoroethylene (PTFE) | Beryllium Copper | Gold | Beryllium Copper | Solder | Gold | ||||||
TE Connectivity AMP Connectors 8080-1G45 | Chassis Mount | 3 | -55 °C | 125 °C | Transistor, TO-3 | Closed Frame | Polytetrafluoroethylene (PTFE) | Beryllium Copper | Tin | Beryllium Copper | Solder |