UMT2907AT106
ActiveRohm Semiconductor
BIPOLAR (BJT) SINGLE TRANSISTOR, PNP, 60 V, 600 MA, 200 MW, SOT-323, SURFACE MOUNT
UMT2907AT106
ActiveRohm Semiconductor
BIPOLAR (BJT) SINGLE TRANSISTOR, PNP, 60 V, 600 MA, 200 MW, SOT-323, SURFACE MOUNT
Description
General part information
UMT2907 Series
Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.
Technical Specifications
Parameters and characteristics for this part
| Specification | UMT2907AT106 |
|---|---|
| Current - Collector (Ic) (Max) | 0.6 mA |
| Current - Collector Cutoff (Max) | 100 nA |
| DC Current Gain (hFE) (Min) | 100 |
| Frequency - Transition | 200 MHz |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | SC-70, SOT-323 |
| Package Name | UMT3 |
| Power - Max | 200 mW |
| Transistor Type | PNP |
| Vce Saturation (Max) | 1.6 V |
| Voltage - Collector Emitter Breakdown (Max) | 60 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
UMT3 Part Marking
UMT3 T106 Taping Spec
Transistor, MOSFET Flammability
How to Use LTspice® Models
Measurement Method and Usage of Thermal Resistance RthJC
Anti-Whisker formation - Transistors
Moisture Sensitivity Level - Transistors
How to Use LTspice® Models: Tips for Improving Convergence
Basics of Thermal Resistance and Heat Dissipation
Precautions When Measuring the Rear of the Package with a Thermocouple
Condition of Soldering / Land Pattern Reference
Notes for Temperature Measurement Using Thermocouples
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Impedance Characteristics of Bypass Capacitor
ESD Data
List of Transistor Package Thermal Resistance
Notes for Calculating Power Consumption:Static Operation
Types and Features of Transistors
What Is Thermal Design
What is a Thermal Model? (Transistor)
Method for Monitoring Switching Waveform
Temperature derating method for Safe Operating Area (SOA)
Reliability Test Result
Compliance of the RoHS directive
Calculation of Power Dissipation in Switching Circuit
Part Explanation
PCB Layout Thermal Design Guide
Importance of Probe Calibration When Measuring Power: Deskew
About Export Regulations
Two-Resistor Model for Thermal Simulation
Inner Structure
Notes for Temperature Measurement Using Forward Voltage of PN Junction
How to Create Symbols for PSpice Models
Certificate of not containing SVHC under REACH Regulation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Package Dimensions