MCJCQ21GBB7472MTPA01

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TAIYO YUDEN

CAP CER 4700PF 250V X7R 0805

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Active

TAIYO YUDEN

CAP CER 4700PF 250V X7R 0805

Technical Specifications

Parameters and characteristics for this part

Specification	MCJCQ21GBB7472MTPA01

Applications	Boardflex Sensitive, Automotive
Capacitance	4700 pF
Features	Soft Termination
Mounting Type	Surface Mount, MLCC
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Package / Case	0805
Ratings	AEC-Q200
Size / Dimension [x]	2 mm
Size / Dimension [x]	0.079 in
Size / Dimension [y]	0.049 in
Size / Dimension [y]	1.25 mm
Temperature Coefficient	X7R
Thickness (Max) [Max]	1.35 mm
Thickness (Max) [Max]	0.053 in
Tolerance	20 %
Voltage - Rated	250 V

Part	Temperature Coefficient	Operating Temperature [Min]	Operating Temperature [Max]	Thickness (Max) [Max]	Thickness (Max) [Max]	Features	Voltage - Rated	Tolerance	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [y]	Capacitance	Mounting Type	Package / Case	Applications	Ratings
TAIYO YUDEN MCJCQ219NB7102MTPA1J	X7R	-55 °C	125 °C	0.95 mm	0.037 in	Soft Termination	250 V	20 %	2 mm	0.079 in	0.049 in	1.25 mm	0.001 µF	MLCC Surface Mount	0805	Boardflex Sensitive
TAIYO YUDEN MCJCQ21GBB7472MTPA01	X7R	-55 °C	125 °C	1.35 mm	0.053 in	Soft Termination	250 V	20 %	2 mm	0.079 in	0.049 in	1.25 mm	4700 pF	MLCC Surface Mount	0805	Automotive Boardflex Sensitive	AEC-Q200
TAIYO YUDEN MCJCQ21GBB7472KTPA1J	X7R	-55 °C	125 °C	1.35 mm	0.053 in	Soft Termination	250 V	10 %	2 mm	0.079 in	0.049 in	1.25 mm	4700 pF	MLCC Surface Mount	0805	Boardflex Sensitive
TAIYO YUDEN MCJCQ21GBB7472KTPA01	X7R	-55 °C	125 °C	1.35 mm	0.053 in	Soft Termination	250 V	10 %	2 mm	0.079 in	0.049 in	1.25 mm	4700 pF	MLCC Surface Mount	0805	Automotive Boardflex Sensitive	AEC-Q200

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	2000	$ 0.08

General part information

4700 pF ±20% 250V Ceramic Capacitor X7R 0805 (2012 Metric)

Technical documentation and resources