Specification	BR25H640FVT-2ACE2

Clock Frequency	10 MHz
Grade	Automotive
Memory Depth	8 K
Memory Format	EEPROM
Memory Interface (Type)	SPI
Memory Size	8 KB
Memory Type	Non-Volatile
Memory Width	8 bit
Mounting Type	Surface Mount
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package Length	0.173 in
Package Name	8-TSSOP, 8-TSSOP-B
Package Width	4.4 mm
Qualification	AEC-Q100
Technology	EEPROM
Voltage - Supply (Maximum)	5.5 V
Voltage - Supply (Minimum)	2.5 V
Write Cycle Time - Page	4 ms
Write Cycle Time - Word	4 ms

BR25H640 Series

64KBit, SPI BUS, High Speed Write Cycle, High Endurance, Serial EEPROM for Automotive (125℃ Operation)

Part	Memory Depth	Memory Width	Memory Format	Technology	Package Name	Mounting Type	Write Cycle Time - Page	Write Cycle Time - Word	Memory Type	Package Length	Package Width	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Clock Frequency	Operating Temperature (Max)	Operating Temperature (Min)	Memory Size	Memory Interface (Type)	Grade	Qualification
Rohm Semiconductor BR25H640FJ-5ACE2	8 K	8 bit	EEPROM	EEPROM	8-SOIC 8-SOP-J	Surface Mount	3.5 ms	3.5 ms	Non-Volatile	0.154 in	3.9 mm	1.7 V	5.5 V	20 MHz	125 °C	-40 °C	8 KB	SPI
Rohm Semiconductor BR25H640F-2CE2	8 K	8 bit	EEPROM	EEPROM	8-SOIC 8-SOP	Surface Mount	4 ms	4 ms	Non-Volatile	0.173 in	4.4 mm	2.5 V	5.5 V	10 MHz	125 °C	-40 °C	8 KB	SPI	Automotive	AEC-Q100
Rohm Semiconductor BR25H640FVT-5ACE2	8 K	8 bit	EEPROM	EEPROM	8-TSSOP 8-TSSOP-B	Surface Mount	3.5 ms	3.5 ms	Non-Volatile	0.173 in	4.4 mm	1.7 V	5.5 V	20 MHz	125 °C	-40 °C	8 KB	SPI	Automotive	AEC-Q100
Rohm Semiconductor BR25H640F-2LBH2	8 K	8 bit	EEPROM	EEPROM	8-SOIC 8-SOP	Surface Mount	4 ms	4 ms	Non-Volatile	0.154 in	3.9 mm	2.5 V	5.5 V	5 MHz	125 °C	-40 °C	8 KB	SPI
Rohm Semiconductor BR25H640FVT-2CE2	8 K	8 bit	EEPROM	EEPROM	8-TSSOP 8-TSSOP-B	Surface Mount	4 ms	4 ms	Non-Volatile	0.173 in	4.4 mm	2.5 V	5.5 V	10 MHz	125 °C	-40 °C	8 KB	SPI	Automotive	AEC-Q100
Rohm Semiconductor BR25H640FVM-5ACTR	8 K	8 bit	EEPROM	EEPROM	8-MSOP	Surface Mount	3.5 ms	3.5 ms	Non-Volatile	0.11 in	2.8 mm	1.7 V	5.5 V	20 MHz	125 °C	-40 °C	8 KB	SPI
Rohm Semiconductor BR25H640FVT-2ACE2	8 K	8 bit	EEPROM	EEPROM	8-TSSOP 8-TSSOP-B	Surface Mount	4 ms	4 ms	Non-Volatile	0.173 in	4.4 mm	2.5 V	5.5 V	10 MHz	125 °C	-40 °C	8 KB	SPI	Automotive	AEC-Q100
Rohm Semiconductor BR25H640F-2ACE2	8 K	8 bit	EEPROM	EEPROM	8-SOIC 8-SOP	Surface Mount	4 ms	4 ms	Non-Volatile	0.173 in	4.4 mm	2.5 V	5.5 V	10 MHz	125 °C	-40 °C	8 KB	SPI	Automotive	AEC-Q100
Rohm Semiconductor BR25H640FVM-2ACTR	8 K	8 bit	EEPROM	EEPROM	8-MSOP	Surface Mount	4 ms	4 ms	Non-Volatile	0.11 in	2.8 mm	2.5 V	5.5 V	10 MHz	125 °C	-40 °C	8 KB	SPI	Automotive	AEC-Q100
Rohm Semiconductor BR25H640FJ-2ACE2	8 K	8 bit	EEPROM	EEPROM	8-SOIC 8-SOP-J	Surface Mount	4 ms	4 ms	Non-Volatile	0.154 in	3.9 mm	2.5 V	5.5 V	10 MHz	125 °C	-40 °C	8 KB	SPI	Automotive	AEC-Q100

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

AEC-Q101 Automotive Requirements

TSSOP-B8 Dry Pack Taping Spec

BR25H640FVT-2ACE2 Flammability