RBR5L30ATE25
NRNDRohm Semiconductor
SCHOTTKY DIODES & RECTIFIERS DIODE, RECTIFIER FRD 30V-VR 5A-IO SINGLE
RBR5L30ATE25
NRNDRohm Semiconductor
SCHOTTKY DIODES & RECTIFIERS DIODE, RECTIFIER FRD 30V-VR 5A-IO SINGLE
Description
General part information
RBR5L30 Series
RBR5L30BDD is the high reliability Automotive Schottky Barrier Diode, suitable for general rectification.
Technical Specifications
Parameters and characteristics for this part
| Specification | RBR5L30ATE25 |
|---|---|
| Current - Average Rectified (Io) | 5 A |
| Current - Reverse Leakage | 100 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 150 °C |
| Package / Case | SMA, DO-214AC |
| Package Name | PMDS |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 30 V |
| Voltage - Forward (Vf) (Max) | 540 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
RBR5L30ATE25 | Datasheet
About Flammability of Materials
Notes for Temperature Measurement Using Thermocouples
Notes for Calculating Power Consumption:Static Operation
Inner Structure
How to Use the Thermal Resistance and Thermal Characteristics Parameters
About Export Regulations
Part Explanation
How to Select Rectifier Diodes
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Method for Monitoring Switching Waveform
How to Select Reverse Current Protection Diodes for LDO Regulators
How to Use LTspice® Models: Tips for Improving Convergence
Basics of Thermal Resistance and Heat Dissipation
Power Loss and Thermal Design of Diodes
How to Use LTspice® Models
Diode Selection Method for Asynchronous Converter
Impedance Characteristics of Bypass Capacitor
PCB Layout Thermal Design Guide
Absolute Maximum Rating and Electrical Characteristics of Diodes
Diode Types and Applications
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
List of Diode Package Thermal Resistance
What Is Thermal Design
Constitution Materials List
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Taping Information
Package Dimensions
What is a Thermal Model? (Diode)
Judgment Criteria of Thermal Evaluation
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Anti-Whisker formation - Diodes
Moisture Sensitivity Level - Diodes
Report of SVHC under REACH Regulation
Importance of Probe Calibration When Measuring Power: Deskew
Reliability Test Result
Two-Resistor Model for Thermal Simulation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Precautions When Measuring the Rear of the Package with a Thermocouple
Measurement Method and Usage of Thermal Resistance RthJC
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Compliance of the RoHS directive
How to Create Symbols for PSpice Models
ESD Data
Condition of Soldering / Land Pattern Reference
RBR5L30A Data Sheet
Explanation for Marking
