
EMZ8T2R
ActiveRohm Semiconductor
PNP LOW VCE(SAT) TRANSISTOR + NPN GENERAL PURPOSE AMPLIFICATION TRANSISTOR

EMZ8T2R
ActiveRohm Semiconductor
PNP LOW VCE(SAT) TRANSISTOR + NPN GENERAL PURPOSE AMPLIFICATION TRANSISTOR
Description
General part information
EMZ8T2 Series
Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.
Technical Specifications
Parameters and characteristics for this part
| Specification | EMZ8T2R |
|---|---|
| Current - Collector (Ic) (Alternate) | 0.5 A |
| Current - Collector (Ic) (Max) | 150 mA |
| Current - Collector Cutoff (Max) | 100 nA |
| DC Current Gain (hFE) (Min) | 270, 120 |
| Frequency - Transition (Options) | 180MHz, 260MHz |
| Mounting Type | Surface Mount |
| NPN Count | 1 |
| Operating Temperature | 150 °C |
| Package / Case | SOT-563, SOT-666 |
| Package Name | EMT6 |
| PNP Count | 1 |
| Power - Max | 150 mW |
| Transistor Type | PNP, NPN |
| Vce Saturation (Max) | 400 mV |
| Voltage - Collector Emitter Breakdown (Max) (Value 1) | 50 V |
| Voltage - Collector Emitter Breakdown (Max) (Value 2) | 12 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Impedance Characteristics of Bypass Capacitor
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Anti-Whisker formation - Transistors
Temperature derating method for Safe Operating Area (SOA)
Moisture Sensitivity Level - Transistors
Method for Monitoring Switching Waveform
Explanation for Marking
Precautions When Measuring the Rear of the Package with a Thermocouple
How to Create Symbols for PSpice Models
About Flammability of Materials
What Is Thermal Design
Package Dimensions
Compliance of the RoHS directive
What is a Thermal Model? (Transistor)
Taping Information
Notes for Calculating Power Consumption:Static Operation
Basics of Thermal Resistance and Heat Dissipation
How to Use LTspice® Models: Tips for Improving Convergence
How to Use LTspice® Models
About Export Regulations
Measurement Method and Usage of Thermal Resistance RthJC
Part Explanation
Calculation of Power Dissipation in Switching Circuit
Condition of Soldering / Land Pattern Reference
Inner Structure
Importance of Probe Calibration When Measuring Power: Deskew
List of Transistor Package Thermal Resistance
Reliability Test Result
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Certificate of not containing SVHC under REACH Regulation
Types and Features of Transistors
Notes for Temperature Measurement Using Thermocouples
PCB Layout Thermal Design Guide
ESD Data
Two-Resistor Model for Thermal Simulation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data